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About L3Harris
L3Harris Technologies is a US aerospace and defense technology company providing space and airborne systems, communications, electronic warfare, and missile propulsion solutions for government and commercial customers.
L3Harris currently has
864 open roles
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Listed pay typically runs
$106,500–$197,500
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The Senior Specialist, Senior Microelectronics Failure Analysis Engineer leads investigations into microelectronic component and circuit level assembly failures occurring during manufacturing, qualification, testing, or field operations. This role involves developing investigative plans, performing hands-on electrical and physical analysis, and interpreting evidence to identify root cause failure mechanisms. Key responsibilities include using optical microscopy, X-ray inspection, cross-sectioning, scanning electron microscopy, photoemission microscopy, electrical testing, decapsulation, and delayering to characterize defects in semiconductor devices, metallization, and package interconnects. The engineer must correlate electrical measurements with physical observations to distinguish symptoms from underlying causes like electrical overstress or corrosion. The role requires technical judgment to recommend corrective actions for design, material, or process improvements while producing clear technical reports for both technical and non-technical audiences.
Lead microelectronic failure investigations from initial assessment through root cause determination and corrective action verification.
Establish analysis strategies and sequence techniques to preserve critical information during component failure investigations.
Perform electrical testing and characterization to reproduce failures and isolate suspect circuits or connections.
Prepare samples using decapsulation, cross-sectioning, and controlled delayering to expose internal features.
Examine exposed structures using SEM to characterize defects in semiconductor devices, metallization, and interconnects.
Correlate electrical measurements and imaging results with manufacturing history to distinguish symptoms from underlying causes.
Translate investigation findings into practical design, material, or process improvements with engineering and manufacturing teams.
Produce technical reports and present detailed findings to both technical teams and non-technical stakeholders.
What we're looking for
Bachelor’s degree in Electrical Engineering, Materials Science, Physics, Microelectronics, or related field with at least six years of relevant experience.
Graduate degree with at least four years of relevant experience.
Minimum of ten years of relevant experience in lieu of a degree.
Physical Failure Analysis
SEM
TEM
FIB
IC Fabrication
Advanced Packaging
De-processing
Cross-sectioning
Electron Microscopy
Design of Experiments
Root-Cause Analysis
Silicon Architecture
Plasma De-processing
Failure Analysis
SEM
TEM
FIB
IC Fabrication
Advanced Packaging
Electron Microscopy
Design of Experiments
Plasma De-processing
Cross-sectioning
De-layering
Root-Cause Analysis
Physical Characterization
Python
Rust
Shell Scripting
Linux
CI/CD
AI
Machine Learning
Data Pipelines
Databases
EDA
CAD
Version Control
Observability
Automation Frameworks
Workflow Orchestration
Data Analytics