Senior Physical Failure Analysis Engineer

What you'll do

• Design and implement cutting-edge methodologies for root-cause investigations on leading-edge silicon and heterogeneous packaging.
• Perform mechanical cross-sectioning, parallel de-layering, and chemical/plasma de-processing of IC devices across multiple levels.
• Apply Focused Ion Beam (FIB) sample preparation and analysis for high-resolution electrical and physical diagnostics.
• Develop novel characterization techniques and specialized analysis platforms for emerging chip structures and silicon architectures.
• Design and implement robust failure analysis workflows to improve laboratory efficiency and ensure reproducible results.
• Lead high-impact investigations to isolate root causes affecting product yield, performance, and long-term reliability.
• Deliver physical characterization data to support design optimization, process node improvements, and customer failure analysis requests.

What we're looking for

• Hold a B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, or a related field (or equivalent experience).
• Possess at least 8 years of relevant, hands-on experience in failure analysis.
• Demonstrate deep understanding of semiconductor IC fabrication, advanced packaging/assembly processes, and failure analysis methodologies.
• Show proven proficiency in precision IC device sample preparation for defect localization and root-cause analysis.
• Possess hands-on expertise with advanced Optical and Electron microscopy (SEM/TEM) and related analytical inspection techniques.
• Maintain strong working knowledge of physical and electrical failure analysis across die, package, component, and board levels.
• Ability to perform mechanical cross-sectioning, parallel de-layering, and advanced chemical/plasma de-processing of IC devices.
• Ability to apply advanced Focused Ion Beam (FIB) sample preparation and analysis techniques for high-resolution diagnostics.