Senior Failure Analysis Engineer, Microelectronics

What you'll do

• Perform end-to-end root cause failure analysis on microelectronic components in manufacturing, testing, and field environments.
• Conduct advanced electrical fault isolation using techniques like TDR, RF characterization, and nanoprobing to locate defects.
• Execute physical failure analysis using SEM, FIB, EDS, and cross-sectioning to identify mechanisms in silicon and packaging.
• Apply physics-of-failure principles to determine root causes such as electromigration, thermal fatigue, and delamination.
• Drive corrective actions by collaborating with design and manufacturing teams to implement and validate process changes.
• Author detailed technical reports documenting failure modes, data analysis, and the effectiveness of corrective actions.
• Develop and improve failure analysis workflows to support new packaging technologies and advanced materials.

What we're looking for

• Bachelor's degree in materials science, electrical engineering, physics, chemical engineering, or another STEM discipline.
• 5+ years of hands-on experience in microelectronics failure analysis or materials characterization.
• Master's or PhD in a relevant STEM field with a focus on microelectronics or failure analysis (preferred).
• 10+ years of hands-on experience in microelectronics failure analysis or materials characterization (preferred).
• Proficiency with advanced FA tools including SEM, FIB, SAM, and EDS (preferred).
• Experience with electrical characterization and fault isolation techniques such as IV curves, RF/VNA measurement, LIT, OBIRCH, EBIRCH, EBAC, nanoprobing, photon emission, or voltage contrast (preferred).
• Experience applying JEDEC and AEC reliability test standards and physics-of-failure methodologies to root cause investigations (preferred).
• U.S. citizen.