Senior Integrated Circuit Wafer Probe Hardware Design & Validation Engineer (Probe Specialist)

What you'll do

• Lead the mechanical and electrical architecture of advanced probe cards including vertical, MEMS, and direct dock technologies.
• Perform signal integrity and power integrity simulations to optimize impedance, crosstalk, and power plane performance.
• Conduct mechanical analyses on contact force distribution, alignment, planarity, and thermal expansion warpage.
• Architect and evaluate probe solutions for wafer sort, 3D IC subassemblies, and singulated die probing.
• Quantify hardware performance using advanced lab equipment including TDR oscilloscopes, VNAs, and microscopes.
• Lead failure analysis investigations for probe wear, burn, and alignment issues to implement corrective design actions.
• Manage relationships with external probe and probe card design companies to oversee production and development.

What we're looking for

• Bachelor’s, Master’s, or Ph.D. in Electrical Engineering, Mechanical Engineering, Materials Science, or a related discipline.
• 12+ years of hands-on experience in probe card design, vertical/MEMS probes, or high-performance test fixture development.
• Proficiency with Vector Network Analyzers (VNAs), Time-Domain Reflectometry (TDR), and oscilloscopes to analyze SI and PI performance.
• Deep understanding of transmission line theory, RF/microwave principles, and signal/power integrity fundamentals.
• High proficiency with 3D CAD software such as SolidWorks, Autodesk Inventor, or Creo and FEA modeling techniques.
• Experience with production wafer probers or singulated die probers with ATE (preferred).
• Knowledge of metallurgy, micro-plating, or advanced materials science related to probe tip wear and contact physics (preferred).
• Experience with scripting languages like Python or MATLAB and AI tools for data automation (preferred).