Senior IC Packaging Engineer | Microsoft Careers

Microsoft

Quick summary

Work type
On-site
Location
—
Salary
$119,800–$234,700 / yr
Posted
5 days ago
Closes
Dec 7, 2026

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $188k
This role $177k
$106k most similar roles pay here $248k

This role pays more than 65% of similar roles. Most pay $163,416–$213,375 — the shaded band above. At the midpoint, this role pays about $177k versus about $188k for comparable roles.

Based on 240 similar postings.

Employer

About Microsoft

Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing

Microsoft currently has 1580 open roles on FindRole.

Listed pay typically runs $119,800–$234,700 across 1408 roles with salary data.

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At a glance

TL;DR · Senior IC Packaging Engineer | Microsoft Careers

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The Senior IC Packaging Engineer role within the Silicon Manufacturing & Package Engineering (SMPE) team at Microsoft involves providing critical expertise throughout the product lifecycle for hardware manufacturing. This senior-level position focuses on supporting new custom silicon device design and implementation, evaluating packaging technology, and driving quality and reliability in development and production. Key responsibilities include optimizing silicon packaging solutions for Azure datacenter products, developing advanced 2.5D/3D packaging technologies, and managing supplier assessments. The ideal candidate will have extensive experience with semiconductor package product development, manufacturing, and supplier management, along with a strong foundation in advanced packaging technologies and EDA tools requirements. Proficiency in electrical engineering or related fields is essential, alongside expertise in OSAT, foundry technologies, and physical failure analysis.

Skills

EDA 2.5D/3D_Packaging BGA Substrate_Design Package_Qualification Supplier_Assessment Manufacturing_Bring_Up Quality_Control Reliability_Engineering Azure Silicon_Device_Development Motherboard_Design Thermal_Architecture Power_Management Cross_Functional_Collaboration

What you'll do

  • Drive optimal silicon packaging solutions for Azure datacenter product roadmap.
  • Lead the development of 2.5D/3D packaging designs from definition to tapeout.
  • Define and develop test vehicles to validate Silicon, Package, System performance.
  • Design package and assembly drawings to support manufacturing processes.
  • Manage supplier assessments and oversee suppliers through various stages.
  • Drive engineering system design decisions for platform-specific technology needs.

What we're looking for

  • Doctorate or Master's degree in relevant field with extensive technical engineering experience (1+ to 10+ years).
  • Hands-on experience in semiconductor package development, manufacturing, supplier management, and quality management.
  • Expertise in advanced packaging technologies such as BGA, 2.5D/3D ICs.
  • Experience with OSAT, supplier, and foundry technologies.
  • Strong verbal and written communication skills for cross-functional collaboration.
  • Record of success in leading cross-functional teams and driving engineering system design decisions.

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