Senior Custom ASIC Engineering Lead

Broadcom

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Quick summary

Work type
On-site
Location
San Jose, CAFort Collins, COIrvine, CA
Salary
$143,800–$230,000 / yr
Employment
Full-time
Posted
130 days ago
Freshness
Confirmed live today
Closes
Dec 16, 2026

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $200k
This role $187k
$132k $257k
below market most similar roles pay here above market

This role pays less than 59% of similar roles. Most pay $177,250–$222,625 — the blue band above. At the midpoint, this role pays about $187k versus about $200k for comparable roles.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 280 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 169 roles with salary data.

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At a glance

TL;DR · Senior Custom ASIC Engineering Lead

The Senior Custom ASIC Engineering Lead joins the ASIC Products Division to guide customer teams designing challenging chips for AI, HPC, networking, and storage. This role involves managing external customer ASIC programs from inception to production, including RFQs, design, test, packaging, and fabrication. You will advise customers on best practices in EDA flows and design methodologies while proactively assessing risks to design quality and project schedules. Key responsibilities include executing physical design flows to ensure tape-in netlists meet stringent quality standards. Required skills include multiple tape-outs in advanced technology nodes, PPA tradeoff analysis, low power design, and hands-on experience in physical design, STA, and logic simulation. You must be proficient in TCL, shell, and scripting languages to support these complex semiconductor infrastructure projects.

What you'll do

  • Manage external customer ASIC programs from inception through production.
  • Advise customers on best practices for EDA flows and design methodologies.
  • Proactively assess design quality risks and execute mitigation actions with cross-functional teams.
  • Execute physical design flows to verify that customer netlists meet tape-out quality standards.
  • Analyze PPA tradeoffs among various library components and architectures.
  • Participate in chip discussions with marketing, sales, legal, and regulatory compliance teams.
  • Stay updated on developments in Broadcom IPs, technology, and end-user applications.

What we're looking for

  • Bachelor's degree and 12+ years of related experience; or Master's degree and 10+ years of related experience.
  • Proven experience with multiple tape-outs in advanced technology nodes.
  • Knowledgeable in low power design and power management.
  • Hands-on experience in physical design, STA, EDA tools, design flows, logic simulation, test, and packaging.
  • Programming skills in TCL, shell, and scripting languages.
  • Ability to analyze PPA tradeoffs involved amongst various library components and architectures.
  • Exposure to SERDES communications protocols (preferred).
  • Knowledge of logic design, chip architecture, microarchitecture, Verilog RTL coding, and DFT methods (preferred).

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