Principal CPU Physical Design Engineer

Qualcomm

Confirmed live today High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$216,600–$325,000 / yr
Posted
35 days ago
Freshness
Confirmed live today
Closes
Mar 21, 2027

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $204k
This role $271k
$143k $345k
below market most similar roles pay here above market

This role pays more than 94% of similar roles. Most pay $177,250–$231,187 — the blue band above. At the midpoint, this role pays about $271k versus about $204k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 575 open roles on FindRole.

Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.

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At a glance

TL;DR · Principal CPU Physical Design Engineer

The Principal CPU Physical Design Engineer joins the CPU Engineering team to drive the implementation of next-generation CPU cores at advanced nodes. This role involves owning critical portions of CPU implementation from RTL to GDS, with a primary focus on PPA convergence and design quality. The engineer will perform timing, power, and area optimizations for high-frequency subsystems while solving complex silicon problems like congestion, variability, EM/IR, and power integrity. Key responsibilities include developing methodologies, flows, and automation to improve scalability and collaborating with EDA vendors. Required skills include full RTL-to-GDSII implementation experience, including synthesis, place and route, STA, and signoff. Candidates should possess scripting proficiency in TCL or Python and experience with Synopsys or Cadence tools to address CPU-specific design challenges.

What you'll do

  • Own critical portions of CPU implementation from RTL to GDS with a focus on PPA convergence.
  • Drive timing, power, and area optimization for high-frequency, complex CPU subsystems.
  • Solve hard silicon problems including timing closure, congestion, variability, EM/IR, and power integrity.
  • Develop and deploy methodologies, flows, and automation to improve scalability and Quality of Results.
  • Influence EDA vendors and CAD teams to push tool capabilities for advanced nodes.
  • Contribute to next-generation design strategies for advanced semiconductor nodes.
  • Mentor junior engineers and help raise the technical bar of the engineering team.

What we're looking for

  • 10+ years of experience in ASIC/SoC Physical Design.
  • Bachelor's degree in a related field and 8+ years of engineering experience, OR Master's degree and 7+ years, OR PhD and 6+ years.
  • Strong experience with full RTL-to-GDSII implementation including synthesis, place & route, STA, and signoff.
  • Experience in timing closure and power optimization.
  • Scripting skills in TCL, Python, or similar.
  • Experience working on CPU cores or other high-performance designs (preferred).
  • Expertise in advanced nodes such as 7nm, 5nm, 3nm or below (preferred).
  • Hands-on experience with industry-standard tools like Synopsys or Cadence (preferred).

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