R&D IC Design Engineer
Broadcom
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How this pay compares to similar roles
This role pays less than 65% of similar roles. Most pay $152,875–$213,375 — the shaded band above. At the midpoint, this role pays about $165k versus about $183k for comparable roles.
Based on 240 similar postings.
Employer
Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software
Broadcom currently has 61 open roles on FindRole.
Listed pay typically runs $120,000–$192,000 across 60 roles with salary data.
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At a glance
As a senior chip design engineer on the high-speed communication team, you will architect block-level designs enabling 10Gbps to 400Gbps data transmission across various mediums including backplane, cable, and optical fiber. Your daily tasks include translating marketing and system requirements into detailed design specifications, conducting HDL coding, equivalency checking, timing analysis, and simulation scripting for IC design validation. You will also develop verification plans, perform power and resource trade-off analyses, and ensure low-power and testability in your designs. Essential skills include expertise in ARM subsystems, high-speed digital circuit design, 10G/100G Ethernet, OTN networks, RTL simulation, synthesis, and scripting languages like Verilog, VHDL, Unix/Perl, Python, and C. Experience with High-level Synthesis is beneficial. This role requires strong analytical skills, hands-on debugging experience, and the ability to collaborate effectively in a global team environment.
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