Product Reliability Engineer, HTOL/Burn-In Development

Amd

Confirmed live 2 days ago High trust

Quick summary

Work type
On-site
Location
Austin, TX
Salary
$130,400–$195,600 / yr
Posted
16 days ago
Freshness
Confirmed live 2 days ago
Closes
Aug 26, 2027

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $178k
This role $163k
$120k most similar roles pay here $231k

This role pays less than 64% of similar roles. Most pay $142,500–$213,817 — the shaded band above. At the midpoint, this role pays about $163k versus about $178k for comparable roles.

Based on 240 similar postings.

Employer

About Amd

AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors

Amd currently has 367 open roles on FindRole.

Listed pay typically runs $166,400–$249,600 across 367 roles with salary data.

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At a glance

TL;DR · Product Reliability Engineer, HTOL/Burn-In Development

Product Reliability Engineer – HTOL/Burn-In Development (MCC/C-Breez) joins a global product reliability team to drive qualifications for next-generation datacenters and servers using advanced silicon and packaging technologies. The role involves developing end-to-end hardware and software solutions for High Temperature Operating Life and Burn-in tests to characterize silicon reliability behavior. Responsibilities include designing custom High-Power Burn-In Boards for CPUs and GPUs, integrating test patterns into stress programs, debugging hardware and PNP software issues, and conducting data analysis to optimize test programs. The candidate will utilize the MCC C-Breez environment along with Python, C++, SQL, and scripting languages. Technical tasks involve collaborating with fabrication partners, managing board bring-up, and using oscilloscopes and logic analyzers. This role addresses critical reliability challenges by ensuring new products meet specific performance requirements through rigorous stress testing and hardware validation.

What you'll do

  • Design custom High-Power Burn-In Boards (BIBs) for CPU and GPU products during the early development cycle.
  • Interface with PCB fabrication and socket manufacturers to guide board development and manufacturing.
  • Establish HTOL/BI pattern requirements and work with engineering teams to bring up burn-in DFT patterns.
  • Integrate, debug, and maintain reliability test code using the MCC C-Breez environment or associated platform software.
  • Lead hardware validation of First Article boards for HTOL and Burn-in while debugging hardware and PNP software issues.
  • Coordinate with offshore factories and reliability labs during hardware and test program bring-up.
  • Analyze pre- and post-burn-in test data to identify opportunities for stress program optimization.
  • Develop data-logging scripts to capture parametric drift, test logs, and qualification metrics.

What we're looking for

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or a related field.
  • Experience developing High Temperature Operating Life (HTOL) and Burn-in hardware and stress-test programs.
  • Direct experience with Micro Control Company (MCC) Burn-In platforms and the C-Breez software environment.
  • Proficiency in programming languages such as Python, C++, or SQL for scripting and data logging.
  • Knowledge of HTOL/BI board schematics, layout, and PCB development to define requirements.
  • Experience using oscilloscopes and logic analyzers to debug Burn-in boards.
  • Knowledge of test pattern architecture, vector translation, and timing diagrams for stress testing.
  • Strong communication skills for technical data presentation and cross-functional collaboration.

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