Process Engineer

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$175,000–$308,500 / yr
Posted
49 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $168k
This role $242k
$106k $330k
below market most similar roles pay here above market

This role pays more than 89% of similar roles. Most pay $137,750–$199,106 — the blue band above. At the midpoint, this role pays about $242k versus about $168k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3498 open roles on FindRole.

Listed pay typically runs $174,200–$277,600 across 2693 roles with salary data.

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At a glance

TL;DR · Process Engineer

JOB TITLE: Process Engineer The ATG Sensing Group is seeking a Senior Electronic Packaging Engineer to drive the development of innovative module packaging solutions for new consumer products. In this role, you will own process development for New Product Introduction, architecting concepts and defining flows to ensure successful high-volume manufacturing with external OSAT partners. You will manage equipment definition, material selection, and process flow design while collaborating with cross-functional teams to solve complex integration challenges. Key responsibilities include utilizing FMEA for reliability, performing simulations to validate designs, and managing projects from proof-of-concept to production. Required expertise includes semiconductor sensor packaging, wafer thinning, die attach, wirebond, and encapsulation. You must demonstrate proficiency in materials science, failure analysis, DOE vs. Hypothesis tools, and leveraging AI to improve project efficiency within the sensing technology domain.

What you'll do

  • Define process equipment, material selection, and process flows for module packaging.
  • Develop new package process concepts from proof-of-concept to full production implementation.
  • Evaluate the impact of packaging processes and materials on system integration.
  • Use simulations to validate design impacts before initiating process development.
  • Identify design and process issues using Failure Mode and Effects Analysis (FMEA).
  • Hand off projects from the engineering phase to operations with clearly defined goals.
  • Manage communication channels with module integrators and key technical suppliers.
  • Leverage AI tools to improve overall project efficiency and process development.

What we're looking for

  • BS degree and 10+ years of relevant industry experience.
  • Proven track record of shipping products with 3rd party manufacturing partners.
  • Ability to lead cross-functional teams and operate independently in complex multi-disciplinary programs.
  • Expert-level knowledge in assembly steps including wafer thinning, dicing, die attach, wirebond, encapsulation, and SMT (preferred).
  • Strong materials science and failure analysis knowledge related to assembly chip-packaging interactions (preferred).
  • Experience using simulations to guide process setup and AI to support process development (preferred).
  • In-depth knowledge of semiconductor sensor packaging technologies (preferred).
  • Experience in capacitive sensing module packaging and customer-facing cosmetic packaging (preferred).

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