Process Engineer

Apple Inc

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Work type
On-site
Location
Austin, TX
Posted
1 day ago
Freshness
Confirmed live yesterday

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Salary context

How this pay compares to similar roles

Similar $160k
$115k most similar roles pay here $205k

This listing doesn't post a salary. Most similar roles pay $130,882–$189,215.

Based on 240 similar postings.

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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 2305 open roles on FindRole.

Listed pay typically runs $175,000–$280,000 across 1873 roles with salary data.

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At a glance

TL;DR · Process Engineer

Process Engineer The Process Engineer joins the ATG Sensing Group as a Senior Electronic Packaging Engineer to develop innovative module packaging solutions for new consumer products. This role involves owning process development for New Product Introduction, where you will architect new concepts and define process flows to ensure successful high-volume manufacturing with external OSAT partners. You will manage equipment definition, material selection, and flow design while collaborating with cross-functional teams to solve complex integration challenges. Key responsibilities include moving projects from proof-of-concept to full production, utilizing FMEA for reliability, and integrating simulations to validate designs. Required expertise includes semiconductor packaging technologies such as wafer thinning, dicing, die attach, wirebond, encapsulation, SMT, and transfer molding. You will also utilize AI to improve project efficiency while addressing technical challenges in the domain of sensing technology and assembly chip-packaging interactions.

What does a Process Engineer earn?

Median $167500 from 32 postings across 6 companies.

See salary data

What you'll do

  • Define process equipment, select materials, and design process flows for module packaging.
  • Develop new package process concepts from proof-of-concept demonstrations to full production implementation.
  • Evaluate the impact of packaging processes and materials on overall system integration.
  • Use simulations to validate the design impact of processes before beginning development.
  • Identify design and process issues through collaboration with reliability teams using FMEA.
  • Manage communication channels and resolve technical issues with external OSAT partners and suppliers.
  • Hand off projects from the engineering phase to operations with clearly defined goals and deliverables.
  • Utilize AI tools to improve overall project efficiency during the development process.

What we're looking for

  • Bachelor of Science degree.
  • 10+ years of relevant industry experience.
  • Proven track record of shipping products with third-party manufacturing partners (OSAT).
  • Expertise in assembly steps including wafer thinning, dicing, die attach, wirebond, encapsulation, SMT, and wafer level packaging (preferred).
  • Knowledge of materials science and failure analysis related to chip-packaging interactions (preferred).
  • Experience using simulation to guide process setup (preferred).
  • Experience leveraging AI to support process development or project efficiency (preferred).
  • Experience in capacitive sensing module packaging and customer-facing cosmetic packaging (preferred).

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