Principal Power and Thermal Architect

Nvidia

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Santa Clara, CA
Salary
$232,000–$368,000 / yr
Posted
18 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $203k
This role $300k
$121k most similar roles pay here $394k

This role pays more than 96% of similar roles. Most pay $171,650–$234,718 — the shaded band above. At the midpoint, this role pays about $300k versus about $203k for comparable roles.

Based on 240 similar postings.

Employer

About Nvidia

Nvidia is a leading designer of graphics processing units (GPUs) and system-on-chip units, powering gaming, professional visualization, data centers, and artificial intelligence workloads. Industry: Semiconductors & AI Computing

Nvidia currently has 896 open roles on FindRole.

Listed pay typically runs $184,000–$287,500 across 876 roles with salary data.

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View all roles at Nvidia

At a glance

TL;DR · Principal Power and Thermal Architect

As a Principal Power and Thermal Architect within the Silicon Co-Design Group, you will architect next-generation system, platform, and datacenter-level power and thermal co-design solutions. You will scout research and industry landscapes to identify emerging ideas in silicon, memory, packaging, and platforms, building product differentiation cases based on performance, reliability, and cost. Your daily work involves leading end-to-end co-design from concept to production while driving alignment across architecture, VLSI, software, and operations teams. You will manage a living intercept pipeline and shape innovation in workload-aware controls, closed-loop telemetry, and advanced cooling. The role requires expertise in system power management, thermal architecture, or memory co-design. Candidates should possess a degree in Electrical Engineering, Computer Engineering, or Computer Science, along with experience in machine learning, data-driven modeling, and high-bandwidth memory technologies to solve complex hardware challenges.

What you'll do

  • Architect next-generation system, platform, and datacenter-level power and thermal co-design solutions.
  • Scan research, academia, and industry partners to identify emerging technologies in silicon, memory, and packaging.
  • Build business cases for candidate ideas based on performance, power, reliability, schedule, and cost.
  • Lead the end-to-end co-design process from initial concept through to final product production.
  • Drive cross-functional alignment across architecture, VLSI, software, platform, and operations teams.
  • Develop innovation in workload-aware controls, telemetry, energy buffering, and advanced cooling technologies.
  • Maintain a pipeline of candidate technologies while tracking their status and decision gates.
  • Brief internal leadership on emerging trends and the future roadmap of power and thermal technologies.

What we're looking for

  • BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience.
  • 15+ years of experience in system-level power, thermal, or related architecture.
  • Deep expertise in areas such as system power management, thermal architecture, platform energy, or memory co-design.
  • Proven track record of taking research-grade ideas through system co-design into measurable product impact.
  • Demonstrated ability to influence and align multi-functional teams without direct reporting authority.
  • External technical recognition through premier publications, patents, or contributions to industry standards and communities.
  • Excellent problem-solving, partnership, and social skills.
  • Experience applying machine learning or data-driven techniques to system power, thermal modeling, or design-space exploration.

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