Principal Power and Thermal Architect

Nvidia

Confirmed live today High trust

Quick summary

Work type
On-site
Location
Santa Clara, CA
Salary
$232,000–$368,000 / yr
Employment
Full-time
Posted
34 days ago
Freshness
Confirmed live today

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $220k
This role $300k
$135k $393k
below market most similar roles pay here above market

This role pays more than 95% of similar roles. Most pay $185,500–$254,750 — the blue band above. At the midpoint, this role pays about $300k versus about $220k for comparable roles.

Based on 240 similar postings.

Employer

About Nvidia

Nvidia is a leading designer of graphics processing units (GPUs) and system-on-chip units, powering gaming, professional visualization, data centers, and artificial intelligence workloads. Industry: Semiconductors & AI Computing

Nvidia currently has 1623 open roles on FindRole.

Listed pay typically runs $184,000–$287,500 across 1110 roles with salary data.

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At a glance

TL;DR · Principal Power and Thermal Architect

The Principal Power and Thermal Architect joins the Silicon Co-Design Group to scout research and identify emerging system-level co-design ideas in power and thermal. This role involves architecting next-generation system, platform, and datacenter-level solutions, driving them from concept to production across the company roadmap. Key responsibilities include building product differentiation cases, leading end-to-end co-design, and aligning architecture, VLSI, software, platform, packaging, and operations teams. The position requires expertise in system power management, thermal architecture, platform energy architecture, workload-aware controls, and memory co-design. Candidates must possess a BS, MS, or PhD in Electrical Engineering, Computer Engineering, or Computer Science. The work focuses on solving technical problems regarding platform-scale energy buffering, advanced cooling intercepts, and datacenter-class power compliance to optimize performance and thermal headroom.

What you'll do

  • Architect next-generation system, platform, and datacenter-level power and thermal co-design solutions.
  • Scan internal research, academia, and industry partners to identify emerging system-level co-design ideas.
  • Build product differentiation cases for candidate ideas based on performance, power, reliability, schedule, and cost.
  • Lead end-to-end co-design from initial concept through to final production.
  • Drive alignment across architecture, VLSI, software, platform, packaging, and operations teams to implement selected technologies.
  • Shape innovation for workload-aware controls, platform telemetry, power compliance, and advanced cooling intercepts.
  • Maintain a living intercept pipeline to track candidates, productization status, and decision gates.
  • Brief SCG and broader NVIDIA leadership on future technology trends and research.

What we're looking for

  • BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or equivalent experience.
  • 15+ years in system-level power, thermal, or related architecture.
  • Deep expertise in system power management, thermal architecture, platform energy architecture, workload-aware controls, or memory co-design.
  • Track record of taking research-grade ideas through system co-design into measurable product impact.
  • Demonstrated multi-functional influence in aligning teams across the company without direct reporting authority.
  • Excellent problem-solving, partnership, and social skills.
  • External technical recognition, premier publications, patents, or industry standards contributions.
  • PhD or equivalent experience with sustained research contributions after entering industry (preferred).

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