PCB Fabrication Process Engineer

Amd

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
CA
Salary
$163,200–$244,800 / yr
Posted
18 days ago
Freshness
Confirmed live yesterday
Closes
Aug 24, 2027

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $181k
This role $204k
$126k most similar roles pay here $257k

This role pays more than 70% of similar roles. Most pay $150,000–$212,500 — the shaded band above. At the midpoint, this role pays about $204k versus about $181k for comparable roles.

Based on 240 similar postings.

Employer

About Amd

AMD (Advanced Micro Devices) is a semiconductor company that develops high-performance processors, graphics cards, and adaptive computing solutions for gaming, data centers, and embedded markets. Industry: Semiconductors

Amd currently has 367 open roles on FindRole.

Listed pay typically runs $166,400–$249,600 across 367 roles with salary data.

Most-posted roles

View all roles at Amd

At a glance

TL;DR · PCB Fabrication Process Engineer

The PCB Fabrication Process Engineer joins the Platform development team to drive performance, quality, and reliability specifications for Datacenter GPU Platform PCBs. This role involves designing high-performance material stacks and complex via-structure interconnects while managing process qualification and adoption to meet signal integrity, power delivery, and thermal-mechanical requirements. The engineer will address design for manufacturing queries, define technology roadmaps, and collaborate with cross-functional teams from conceptualization through mass production. Key technical skills include expertise in high-speed design, PCIe and memory routing, and PCB failure analysis using 3DXRM, SEM, and FTIR Spectroscopy. Candidates should be proficient in Allegro simulation tools and capable of writing scripts in Python, C/C++, or MATLAB for data analysis. The role focuses on solving complex manufacturing challenges to ensure robust architecture for high-performance electronics hardware.

What you'll do

  • Design high-performance material stacks and complex via-structure interconnects for Datacenter GPU Platform PCBs.
  • Resolve Design for Manufacturing (DFM) queries to mitigate fabrication yield issues and ensure on-schedule delivery.
  • Qualify and adopt PCB fabrication technologies to meet signal integrity, power delivery, and thermal-mechanical specifications.
  • Define technology roadmaps and manage vendor engagements to optimize performance, cost, and manufacturability.
  • Oversee platform quality from the conceptualization and feasibility stages through mass production ramp.
  • Drive process improvements while maintaining fast time-to-market product delivery schedules.
  • Perform root cause failure analyses using advanced tools like 3DXRM, SEM, and thermal analysis.

What we're looking for

  • Bachelor's degree in Engineering (Electrical, Computer, Mechanical, Chemical, etc.).
  • Master's degree in Electrical, Electronics & Computer Engineering (preferred).
  • Strong background and solid understanding of complex fabrication processes and high-performance electronics hardware.
  • Technical expertise in assembly reliability test and failure analyses.
  • Experience with destructive and non-destructive PCB failure analysis using 3DXRM, SEM, Thermal analysis, and FTIR Spectroscopy (preferred).
  • Familiarity with 2D/3D Allegro or other Stack Impedance and Loss simulation tools for SI/PI optimizations (preferred).
  • Ability to write scripts in Python, C/C++, or MATLAB for statistical data analysis and tool development (preferred).
  • Experience with Design of Experiments, instrumentation, and data acquisition including uncertainty analysis (preferred).

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