This role pays less than
58%
of similar roles. Most pay
$139,750–$183,037
— the shaded band above.
At the midpoint, this role pays about
$159k
versus about
$161k
for comparable roles.
Based on 240 similar postings.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
834 open roles
on FindRole.
Listed pay typically runs
$148,300–$222,500
across 514 roles with salary data.
As a Staff Packaging Engineer at Qualcomm Technologies, you will lead the development and high-volume manufacturing of advanced integrated circuit packaging technologies for Data Center, AI, Power Management, Compute, and emerging markets. Your day-to-day responsibilities include exploring new FCCSP, FCBGA, and SiP/Module packaging technologies, defining package process flows, collaborating with OSATs and material suppliers, and ensuring Design for Manufacturability (DFM) methodologies are implemented. You will manage complex technical programs, provide regular updates to management, and solve intricate manufacturing challenges. The role requires expertise in Flip Chip CSP, FCBGA, SiP packaging materials, assembly processes, and equipment optimization. Strong knowledge of Failure Mode and Effects Analysis (FMEA), Statistical Process Control/Quality Control (SPC/QC) concepts, and reliability test methods is essential. Ideal candidates have at least 8 years of experience in IC package development and a background in electrical, mechanical, or materials engineering.
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