Principal Packaging Engineer

Medtronic

Remote

Quick summary

Work type
Remote
Location
Memphis, TN
Salary
$124,000–$186,000 / yr
Posted
2 days ago
Closes
Jun 29, 2026

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $182k
This role $155k
$112k most similar roles pay here $235k

This role pays less than 77% of similar roles. Most pay $156,000–$208,075 — the shaded band above. At the midpoint, this role pays about $155k versus about $182k for comparable roles.

Based on 239 similar postings.

Employer

About Medtronic

Medtronic plc is the world's largest medical technology company by revenue, specializing in device-based therapies for over 70 health conditions.

Medtronic currently has 72 open roles on FindRole.

Listed pay typically runs $122,400–$183,600 across 72 roles with salary data.

Most-posted roles

View all roles at Medtronic

At a glance

TL;DR · Principal Packaging Engineer

As a Senior Packaging Engineer at Medtronic, you will join a dynamic team dedicated to advancing medical device packaging solutions. Your primary responsibility is to lead the design and development of advanced packaging systems for steam sterilization cases and trays, ensuring they are robust, compliant, and user-friendly. You will collaborate closely with cross-functional teams including R&D, Quality/Regulatory, Manufacturing, and Marketing to define specifications that meet regulatory standards such as FDA and ISO while also considering environmental risks and manufacturing efficiency. Essential skills include a strong background in packaging engineering, CAD proficiency, and experience with medical device regulations. This role offers opportunities for technical breadth beyond steam sterilization sets into sterile and non-sterile packaging development, contributing to Medtronic’s strategic goals of global packaging excellence and regulatory compliance.

What you'll do

  • Lead the design and development of packaging systems for medical devices.
  • Define packaging specifications considering regulatory requirements and environmental risks.
  • Design package exteriors focusing on usability, aesthetics, and manufacturability.
  • Collaborate with cross-functional teams to capture functional requirements and workflows.
  • Apply knowledge of FDA, ISO, and ASTM standards related to medical device packaging.
  • Manage GMP documentation, DHFs, and change control activities for compliance.

What we're looking for

  • Bachelor’s Degree with 7+ years of Packaging Engineering experience or higher-level degrees with commensurate experience.
  • Expertise in designing and developing packaging systems for medical devices, particularly steam sterilization cases and trays.
  • Proficiency in FDA regulations, ISO standards, and ASTM guidelines related to medical device packaging.
  • Strong collaboration skills across R&D, Quality/Regulatory, Manufacturing, Supply Chain, Marketing, and surgical staff teams.
  • High-level CAD skills and mastery of core engineering principles for innovative packaging solutions.

More like this

Similar roles

Sr. Packaging Engineer

Pfizer

Missouri +1 42 days ago $93,600$156,000
Instron ZebraSci MIMAS Computrac HPLC UPLC SEC LC-MS BiaCORE DSC GC cGMP ISO 13485 FDA ICH USP EP JP compendia combination product regulations data processing report writing ChatGPT Microsoft Copilot

Principal Packaging Engineer- Drug Product Design & Development

Pfizer

Chesterfield, MO +1 42 days ago $106,000$176,600
ISO_13485 GMP FDA ICH USP EP JP_compendia combination_product_regulations Instron ZebraSci Computrac plunger_movement_chambers electronic_lab_notebook project_management CI/CD regulatory_submission quality_systems

Staff Packaging Engineer

Qualcomm

San Diego, CA 169 days ago $154,000$231,000
Flip Chip Wire Bond System in Package (SiP) Design for Manufacturability (DFM) Failure Mode and Effects Analysis (FMEA) Laser Groove Technology Package Manufacturing Technical Project Management Reliability Test Methods Six Sigma

Staff Packaging Engineer

Danaher Corporation

Chaska, MN +3 22 days ago $140,000$160,000
SolidWorks CAD ISTA ASTM DOT ISO GMP UN4G DFM DFT Continuous Improvement Sustainability Automated Filling Lines Cold Chain Thermodynamics Cushion Curves Robotic Palletization

Staff Packaging Engineer

Qualcomm

San Diego, CA 20 days ago $154,000$231,000
FCBGA LGA FCCSP die prep chip attach underfill lid/stiffener attach ball attach DOE planning ABF buildup substrate EMIB wafer bumping processes OSAT material selection equipment suppliers NPI HVM deployment reliability standards test methods qualification procedures failure analysis techniques substrate manufacturing processes technical project management

Sr. Staff Packaging Engineer

Qualcomm

San Diego, CA 58 days ago $180,400$270,600
FCBGA LGA FCCSP DOE ABF EMIB wafer bumping project management communication skills reliability standards test methods qualification procedures failure analysis techniques substrate manufacturing processes technical project management