Packaging Technical Leader

Cisco

Remote

Quick summary

Work type
Remote
Location
San Jose, CA
Salary
$168,800–$241,200 / yr
Posted
152 days ago

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $177k
This role $205k
$135k most similar roles pay here $253k

This role pays more than 79% of similar roles. Most pay $150,600–$203,350 — the shaded band above. At the midpoint, this role pays about $205k versus about $177k for comparable roles.

Based on 239 similar postings.

Employer

About Cisco

Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity

Cisco currently has 174 open roles on FindRole.

Listed pay typically runs $165,000–$241,400 across 174 roles with salary data.

Most-posted roles

View all roles at Cisco

At a glance

TL;DR · Packaging Technical Leader

Cisco is seeking a seasoned Packaging Technical Leader to join its Semi & Optics Packaging team within the Supply Chain Organization, where you will drive innovation in advanced packaging technology and quality for cutting-edge ASIC and silicon photonic products. This role involves collaborating with design engineering, operations, and supply chain teams to innovate next-generation technologies and engage directly with suppliers on technical discussions and problem-solving efforts. Day-to-day responsibilities include overseeing package assembly, process development, reliability qualification, materials testing, and working closely with top-tier partners to develop packaging solutions. You will also contribute to the evaluation of new methods and processes for product design, ensuring Design for Manufacturability/Reliability (DfM/DfR) standards are met. The ideal candidate has over six years of experience in semiconductor or photonic packaging, expertise in advanced packaging processes, and strong problem-solving skills, with a preference for familiarity with co-packaged optics and volume manufacturing.

What you'll do

  • Oversee package assembly, process development, and reliability qualification for advanced packaging technologies.
  • Develop and qualify packaging solutions with top-tier partners for Cisco products.
  • Identify and mitigate risks in multi-functional teams to resolve complex packaging issues.
  • Provide expert guidance on Design for Manufacturability/Reliability (DfM/DfR) to design teams.
  • Evaluate new packaging methods, materials, and processes for implementation in Cisco products.

What we're looking for

  • 6+ years of experience in semiconductor or photonic packaging and assembly process development.
  • Demonstrated technical leadership in advanced packaging technologies like TSV, 2.5D/3D, MCM.
  • Expertise in package design, architecture, and substrate manufacturing processes.
  • Proficiency in advanced problem-solving methodologies and data analysis techniques.
  • Knowledge of physical failure analysis methods for reliability qualification.
  • Familiarity with co-packaged optics and volume manufacturing is preferred.
  • Experience with simulation tools for package design and reliability analysis.

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