Lead Electrical Engineering, MEMS Subject

L3Harris

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Herndon, VAPalm Bay, FL
Salary
$127,500–$236,500 / yr
Posted
20 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $177k
This role $182k
$114k most similar roles pay here $250k

This role pays more than 65% of similar roles. Most pay $147,500–$205,825 — the shaded band above. At the midpoint, this role pays about $182k versus about $177k for comparable roles.

Based on 240 similar postings.

Employer

About L3Harris

L3Harris Technologies is a US aerospace and defense technology company providing space and airborne systems, communications, electronic warfare, and missile propulsion solutions for government and commercial customers.

L3Harris currently has 680 open roles on FindRole.

Listed pay typically runs $106,500–$197,500 across 247 roles with salary data.

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At a glance

TL;DR · Lead Electrical Engineering, MEMS Subject

Lead, Electrical Engineering - MEMS Subject serves as a technical leader within the Nanosystems team, driving innovation in advanced microsystems technology. The role involves leading MEMS, Silicon Photonics, and Photonic Integrated Circuit development from concept through demonstration while establishing technology roadmaps. Responsibilities include managing microfabrication operations, overseeing cleanroom processes, and mentoring the design and fabrication team. The individual will identify new business opportunities, manage IRAD projects, and provide expertise in complex modeling and device characterization for defense applications. Key technical competencies include experience with lithography, etching, deposition, bonding, and wafer-level processing. Proficiency with COMSOL or ANSYS simulation tools is required to design and model devices. The role addresses critical challenges in MEMS design, including RF, optical, and inertial systems, while navigating the complexities of 3D integration and heterogeneous integration approaches.

What you'll do

  • Lead MEMS, Silicon Photonics, and PIC technology development from concept through demonstration.
  • Develop technology roadmaps to drive next-generation microsystems capabilities.
  • Identify and pursue new business opportunities in MEMS and photonic technologies to capture new programs.
  • Provide technical leadership and expertise for complex MEMS design, modeling, and fabrication challenges.
  • Manage the Nanosystems team by overseeing resource allocation, prioritization, and personnel development.
  • Direct microfabrication operations including cleanroom processes, equipment utilization, and process development.
  • Design, model, and validate MEMS devices specifically for defense applications.
  • Represent the company at technical conferences and customer meetings to build industry partnerships.

What we're looking for

  • Bachelor's degree and 9 years of experience, a graduate degree and 7 years of experience, or 13 years of experience without a degree.
  • Ability to obtain and maintain a TS/SCI clearance with CI polygraph.
  • Active TS/SCI clearance (preferred).
  • Expertise in MEMS device design, simulation, microfabrication, and related processes like lithography, etching, deposition, and bonding (preferred).
  • Experience with cleanroom operations, semiconductor processing equipment, and Silicon Photonics or PIC technologies (preferred).
  • Proven track record of leading innovation projects, IRAD initiatives, and successful business development/capture (preferred).
  • Familiarity with FEA tools like COMSOL or ANSYS, packaging technologies, wafer-level processing, and 3D integration (preferred).
  • U.S. citizens.

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