Data Center Hardware Engineering - Hardware System Integration Engineer
Apple Inc
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How this pay compares to similar roles
This role pays less than 64% of similar roles. Most pay $158,550–$226,025 — the shaded band above. At the midpoint, this role pays about $175k versus about $192k for comparable roles.
Based on 240 similar postings.
Employer
Oracle Corporation is a leading multinational technology company specializing in database software, cloud computing, and enterprise software.
Oracle currently has 513 open roles on FindRole.
Listed pay typically runs $97,800–$209,500 across 384 roles with salary data.
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At a glance
Hardware Platform Engineer – Data Center Systems & Rack Integration serves as an individual contributor focused on the development and integration of rack-level hardware platforms for data center deployment. The role involves ensuring designs meet requirements for mechanical integrity, thermal performance, serviceability, and scale while managing system-level design across compute, cooling, and infrastructure interfaces. Key responsibilities include defining platform interfaces with liquid cooling systems, establishing telemetry requirements for power and temperature monitoring, and driving standardization across rack platforms. Candidates must possess a degree in Mechanical Engineering or a related field and have experience with mechanical, thermal, or fluid systems. The role addresses the technical challenges of increasing compute density and cooling complexity by ensuring hardware is practical and ready for global deployment through cross-functional collaboration with engineering, supply chain, and software teams to resolve issues and improve designs.
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