Hardware Designer I

Lam Research

Confirmed live yesterday High trust
Hybrid

Quick summary

Work type
Hybrid
Location
Fremont, CA
Salary
$73,000–$135,000 / yr
Posted
31 days ago
Freshness
Confirmed live yesterday
Closes
Feb 7, 2027

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $186k
This role $104k
$55k most similar roles pay here $244k

This role pays less than 98% of similar roles. Most pay $154,525–$218,393 — the shaded band above. At the midpoint, this role pays about $104k versus about $186k for comparable roles.

Based on 240 similar postings.

Employer

About Lam Research

Lam Research Corporation is a leading American supplier of wafer-fabrication equipment and services to the global semiconductor industry.

Lam Research currently has 299 open roles on FindRole.

Listed pay typically runs $114,000–$253,000 across 141 roles with salary data.

Most-posted roles

View all roles at Lam Research

At a glance

TL;DR · Hardware Designer I

As a Hardware Designer 1 within the Global Products Group, you will contribute to the design and engineering of etch and deposition products for the semiconductor industry. You will translate engineering concepts into manufacturable solutions by designing precise mechanical parts, subassemblies, and layouts while adhering to DFx principles and engineering standards. Your daily responsibilities include creating 3D electrical and pneumatic harness routing, managing Bills of Materials through PLM systems, and collaborating with cross-functional teams to complete the full design cycle. You will utilize tools such as Siemens NX, AutoCAD, SAP, Teamcenter, and Microsoft Office 365. The role requires expertise in sheet metal fabrication, machining, casting, GD&T symbols, and ASME drafting standards. You will apply these skills to improve product performance and reliability for high-performance semiconductor equipment.

What you'll do

  • Design and develop precise mechanical parts and subassemblies for product development.
  • Create layouts that adhere to engineering standards, best practices, and DFx principles.
  • Document and release engineering drawings and Bills of Materials (BOMs) through PLM systems.
  • Manage the full design cycle by defining requirements and conducting design reviews with cross-functional teams.
  • Create 3D electrical and pneumatic harness routing using CAD packages.
  • Translate engineering concepts into manufacturable solutions to improve performance, reliability, and cost.

What we're looking for

  • Associate or Bachelor's degree in Design/Engineering (or related field) with 3+ years of experience, an advanced degree, or equivalent experience.
  • High proficiency in 3D CAD applications such as Siemens NX and AutoCAD.
  • Proficiency in Product Lifecycle Management (PLM) systems like SAP and Teamcenter.
  • Fundamental understanding of mechanical engineering, design methods, processes, and engineering drawings.
  • Solid knowledge of sheet metal design, fabrication, metal machining, casting processes, and material properties.
  • Solid knowledge of welding symbols, GD&T, surface finishes, and ASME drafting standards.
  • Experience with large assembly management methodologies and concurrent engineering principles.
  • Proficiency in Microsoft Office 365 (including CoPilot and Teams) and Adobe Acrobat.
  • Prior experience in the semiconductor equipment industry (preferred).
  • Experience in global cross-functional teams within a matrix organization (preferred).
  • Excellent communication, technical presentation, and written/verbal skills (preferred).

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