Director Superchip SoC Technical Program Manager

Arm Holdings

Confirmed live today High trust

Quick summary

Work type
On-site
Location
Austin, TX
Salary
$308,600–$417,500 / yr
Posted
66 days ago
Freshness
Confirmed live today

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $231k
This role $363k
$154k most similar roles pay here $446k

This role pays more than 98% of similar roles. Most pay $198,700–$264,000 — the shaded band above. At the midpoint, this role pays about $363k versus about $231k for comparable roles.

Based on 240 similar postings.

Employer

About Arm Holdings

Arm Holdings plc is a leading British semiconductor and software design firm, established in 1990 and recognized for developing energy-efficient processor architectures that power nearly all smartphones and a vast range of IoT and computing devices.

Arm Holdings currently has 106 open roles on FindRole.

Listed pay typically runs $209,100–$282,900 across 106 roles with salary data.

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View all roles at Arm Holdings

At a glance

TL;DR · Director Superchip SoC Technical Program Manager

As the Director – Superchip SoC Technical Program Manager, you will serve as the primary orchestrator for complex multi-die SoC programs, ensuring successful tapeout and execution. You will lead the overall execution plan, manage master schedules, and coordinate cross-die interactions while mitigating risks and providing executive supervision. Your daily work involves collaborating with Die, Functional, IP Management, Post-Silicon, and Solution TPMs to drive integration, track metrics, and ensure alignment across multi-functional engineering teams. The role requires expertise in the full SoC development lifecycle, from architecture through tapeout, specifically for datacenter-class SoCs and multi-die or chiplet architectures. You will utilize technical knowledge of silicon build functional areas to manage resources and costs while navigating complex dependencies. Required qualifications include a relevant degree and extensive experience in semiconductor programs and large-scale SoC development.

What you'll do

  • Lead the overall SoC execution plan, master schedule, and tapeout readiness.
  • Coordinate Die TPMs to ensure consistency across all silicon dies.
  • Drive cross-die integration, manage dependencies, and identify critical path items.
  • Supervise functional areas including verification, physical build, power, and IP management.
  • Manage program risks, develop mitigation plans, and escalate issues to executives.
  • Lead major governance events such as architecture reviews and tapeout readiness reviews.
  • Consolidate program metrics and provide actionable insights for executive decision-making.
  • Oversee program resources and engineering costs to align with business objectives.

What we're looking for

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field.
  • 20+ years of semiconductor experience.
  • Minimum 5 years of Technical Program Management experience leading large-scale SoC programs.
  • Experience leading the development and finalization of sophisticated datacenter-class SoCs.
  • Strong understanding of the complete SoC development lifecycle from architecture through tapeout.
  • Demonstrated ability to lead large multi-functional engineering organizations without direct authority.
  • Technical expertise in one or more silicon build functional areas.
  • Experience with multi-die/chiplet architectures, Hyperscalers, or AI/datacenter silicon (preferred).

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