Packaging SIPI Engineer, Senior Staff
Qualcomm
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How this pay compares to similar roles
This role pays less than 62% of similar roles. Most pay $184,875–$259,500 — the blue band above. At the midpoint, this role pays about $213k versus about $222k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 575 open roles on FindRole.
Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.
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At a glance
The Director PCB CAD leads a world-class design team within the Engineering Services Group to manage PCB and PWB designs for centralized hardware teams. This role involves overseeing global workflows, managing complex data, and leading teams from concept through production. Key responsibilities include defining stack-up structures, conducting design rule verifications, and performing signal and power integrity tests. The successful candidate will utilize Mentor Xpedition, Mentor PADS, and Cadence Allegro software while employing Valor and CAM350 for DFM analysis. The position requires expertise in RF, Digital, and High-Speed designs, including MIPI, SERDES, and DDR5x PCIE interfaces. You will solve technical challenges related to high-density electronics packaging, high layer count PCBs, and complex via structures while driving tool automation and process improvements across functional engineering disciplines.
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