Senior Printed Circuit Board (PCB) Designer

Microsoft

Confirmed live today High trust
Hybrid

Quick summary

Work type
Hybrid
Location
—
Salary
$119,800–$234,700 / yr
Posted
1 day ago
Freshness
Confirmed live today
Closes
Apr 7, 2027

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $188k
This role $177k
$106k $248k
below market most similar roles pay here above market

This role pays less than 55% of similar roles. Most pay $160,367–$216,250 — the blue band above. At the midpoint, this role pays about $177k versus about $188k for comparable roles.

Based on 240 similar postings.

Employer

About Microsoft

Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing

Microsoft currently has 648 open roles on FindRole.

Listed pay typically runs $119,800–$234,700 across 624 roles with salary data.

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At a glance

TL;DR · Senior Printed Circuit Board (PCB) Designer

The Senior Printed Circuit Board (PCB) Designer joins the Microsoft Quantum hardware development team to create sophisticated electronics for demanding quantum-hardware environments. This role involves owning complex PCB layouts from initial engineering requirements through design release, including component placement, signal routing, power distribution, and high-density interconnect design. You will collaborate with electrical, mechanical, and manufacturing engineering disciplines to translate schematics into manufacturable designs while improving design methodologies, libraries, and automation. Key technical requirements include proficiency with Cadence Allegro ECAD tools, controlled-impedance, differential-pair, and mixed-signal constraints. The work focuses on solving hardware challenges for quantum computing, specifically designing electronics for cryogenic, low-noise, radio-frequency, and precision-measurement systems. You will also manage Design for Manufacturability (DFM) requirements and produce complete manufacturing release packages for fabrication and assembly.

What you'll do

  • Own complex PCB layouts from engineering requirements through design release, including component placement and signal routing.
  • Develop and maintain PCB layouts using ECAD tools like Cadence Allegro while applying specific design constraints.
  • Perform PCB design reviews including DRC closure, stack-up and material review, and mechanical clearance verification.
  • Collaborate with fabrication and assembly suppliers to address DFM requirements and produce manufacturing release packages.
  • Improve PCB design methodologies, libraries, and workflows to increase design quality and scalability.
  • Translate schematics and system requirements into robust, manufacturable designs with electrical and mechanical teams.

What we're looking for

  • Bachelor's Degree in Electrical Engineering, Computer Engineering, or related field and 5+ years technical engineering experience.
  • Master's Degree in Electrical Engineering, Computer Engineering, or related field and 3+ years technical engineering experience.
  • Ability to pass Microsoft Cloud Background Check and provide proof of citizenship or U.S. permanent residency for export control regulations.
  • Ability to leverage AI tools for engineering research, design analysis, and workflow optimization.
  • Bachelor's Degree in Electrical Engineering, Computer Engineering, or related field and 8+ years technical engineering experience (preferred).
  • Master's Degree in Electrical Engineering, Computer Engineering, or related field and 6+ years technical engineering experience (preferred).
  • Experience using Cadence Allegro or similar ECAD tools to deliver complex, multi-layer PCB designs (preferred).
  • Experience designing electronics for cryogenic, low-noise, RF, or other demanding operating environments (preferred).

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