Next-Gen, High-Speed HBM, LPDDR Memory Subsystem ASIC Digital Design Engineer
Qualcomm
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How this pay compares to similar roles
This role pays less than 67% of similar roles. Most pay $135,187–$203,200 — the shaded band above. At the midpoint, this role pays about $144k versus about $169k for comparable roles.
Based on 240 similar postings.
Employer
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has 834 open roles on FindRole.
Listed pay typically runs $148,300–$222,500 across 514 roles with salary data.
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At a glance
Qualcomm’s high speed parallel interfaces team seeks an ASIC front-end design engineer to join their world-class global team focused on architecting and implementing cutting-edge DDR and die-to-die interfaces for high-speed compute and server applications. The role involves designing RTL and digital IPs that connect SoCs to DRAM devices, ensuring reliable high-speed links in multi-die systems. Daily tasks include collaborating with architecture, verification, timing, and physical design teams to develop control and data-path blocks, requiring expertise in System Verilog, logic synthesis, linting checks, clock domain crossing best practices, low power implementation, and gate-level simulation debug. Ideal candidates have hands-on experience with high-speed parallel interfaces and low-power designs, working effectively in a fast-paced environment across cross-functional teams to support all phases of implementation and silicon bring up.
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