Camera SIPI Engineer

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$175,000–$308,500 / yr
Posted
23 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $191k
This role $242k
$128k $328k
below market most similar roles pay here above market

This role pays more than 83% of similar roles. Most pay $153,500–$228,070 — the blue band above. At the midpoint, this role pays about $242k versus about $191k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3595 open roles on FindRole.

Listed pay typically runs $166,600–$277,600 across 2772 roles with salary data.

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At a glance

TL;DR · Camera SIPI Engineer

As a Camera SIPI Engineer within the Camera Technologies group, you will help design and develop groundbreaking hardware for camera systems, including RGB wide, ultra-wide, tele, and front-facing modules. Your daily responsibilities involve modeling and analyzing camera sub-system SI/PI performance, assessing component-level EM desense and susceptibility risks, and providing design optimization recommendations. You will collaborate with system teams on high-speed channel and power delivery network budgeting while participating in feasibility studies for future technologies. The role requires proficiency in tools such as HFSS, SI-Wave/PSI, Q3D, CST, and ADS, along with experience using VNA, TDR, and Oscilloscopes. You will also utilize JMP for statistical analysis and Python scripting for automation to solve complex signal integrity and power delivery challenges in camera hardware.

What you'll do

  • Model and analyze camera sub-system SI/PI performance and component-level EM risk.
  • Provide feedback and recommendations for design optimization based on performance analysis.
  • Drive new design characterization, validation, and correlation for camera hardware.
  • Budget high-speed channels and power delivery networks for camera feature integration.
  • Participate in design feasibility studies for future camera technologies.
  • Develop new simulation methodologies for sign-off analysis.
  • Run SI/PI simulations for substrate, package, flex, and PCB levels.
  • Use Python scripting to automate simulation setups and JMP for statistical analysis.

What we're looking for

  • BS in Electrical Engineering or other relevant field with at least 3 years of relevant industry experience.
  • Experience in high-speed signal and/or PDN fundamentals.
  • Experience in mainstream tool chain, e.g., HFSS, SI-Wave/PSI, Q3D, CST, and/or ADS.
  • MS/PhD in Electrical Engineering or other relevant field with at least 10 years of industry related experience (preferred).
  • Academic or industry exposure to camera or SI/PI technical areas and/or electro-magnetic concepts (preferred).
  • Experience running substrate, package, flex, and/or PCB level SI/PI simulations (preferred).
  • Comfortable handling VNA, TDR, and/or Oscilloscope in academic or professional settings (preferred).
  • Academic knowledge or experience with image sensor or camera module (preferred).

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