Camera SIPI Engineer

Apple Inc

Confirmed live 2 days ago High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$142,300–$214,300 / yr
Posted
2 days ago
Freshness
Confirmed live 2 days ago

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $186k
This role $178k
$132k most similar roles pay here $238k

This role pays less than 52% of similar roles. Most pay $153,531–$217,500 — the shaded band above. At the midpoint, this role pays about $178k versus about $186k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 2305 open roles on FindRole.

Listed pay typically runs $175,000–$280,000 across 1873 roles with salary data.

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At a glance

TL;DR · Camera SIPI Engineer

As a Camera SIPI Engineer within the Camera Technologies group, you will contribute to the design and development of innovative camera hardware systems, including RGB wide, ultra-wide, tele, and front-facing sensing modules. You will model and analyze sub-system SI/PI performance, assess component-level EM desense and susceptibility risks, and provide recommendations for design optimization. Your daily work involves collaborating with system teams on high-speed channel and power delivery network budgeting, participating in feasibility studies for future technologies, and developing new simulation methodologies for sign-off analysis. You will utilize tools such as HFSS, SI-Wave/PSI, Q3D, CST, and ADS to perform substrate, package, flex, and PCB level simulations. Additionally, you will use VNA, TDR, and Oscilloscopes for testing, while utilizing JMP for statistical analysis and Python scripting to automate simulation setups.

What you'll do

  • Model and analyze camera sub-system SI/PI performance and component-level EM risk.
  • Provide feedback and recommendations for design optimization based on analysis results.
  • Drive new design characterization, validation, and correlation for camera hardware.
  • Budget high-speed channels and power delivery networks for camera feature integration.
  • Participate in feasibility studies for future camera technologies.
  • Develop new simulation methodologies for sign-off analysis.
  • Perform SI/PI simulations across substrate, package, flex, and PCB levels.

What we're looking for

  • BS in Electrical Engineering or another relevant field.
  • Experience in high speed signal and/or PDN fundamentals.
  • Experience with mainstream tool chains such as HFSS, SI-Wave/PSI, Q3D, CST, and/or ADS.
  • MS/PhD in Electrical Engineering or a related field with at least 3 years of industry experience (preferred).
  • Academic or industry exposure to camera systems, SI/PI technical areas, or electromagnetic concepts (preferred).
  • Experience running substrate, package, flex, and/or PCB level SI/PI simulations (preferred).
  • Ability to operate VNA, TDR, and/or Oscilloscopes in academic or professional settings (preferred).
  • Knowledge of image sensors, Python scripting for automation, JMP for statistical analysis, and strong communication skills (preferred).

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