Camera SIPI Engineer

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$122,700–$184,800 / yr
Posted
23 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $192k
This role $154k
$110k $242k
below market most similar roles pay here above market

This role pays less than 75% of similar roles. Most pay $153,750–$229,612 — the blue band above. At the midpoint, this role pays about $154k versus about $192k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3595 open roles on FindRole.

Listed pay typically runs $166,600–$277,600 across 2772 roles with salary data.

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At a glance

TL;DR · Camera SIPI Engineer

As a Camera SIPI Engineer within the Camera Technologies group, you will join the Camera Hardware Engineering team to design and develop innovative hardware for various products. Your primary responsibilities include modeling and analyzing camera sub-system SI/PI performance, assessing component-level EM desense and susceptibility risks, and providing design optimization recommendations. You will assist senior team members with new design characterization, validation, and correlation while collaborating on high-speed channel and power delivery network budgeting for camera feature integration. You will also participate in feasibility studies and develop new simulation methodologies. Required skills include experience with high-speed signal and PDN fundamentals using tools like HFSS, SI-Wave/PSI, Q3D, CST, and ADS. You will solve technical problems involving image sensors, camera modules, and substrate, package, flex, and PCB level simulations.

What you'll do

  • Model and analyze camera sub-system SI/PI performance and component-level EM risk.
  • Provide design optimization recommendations based on SI/PI and EM risk analysis.
  • Drive new design characterization, validation, and correlation for camera hardware.
  • Budget high-speed channels and power delivery networks for camera feature integration.
  • Participate in design feasibility studies for future camera technologies.
  • Develop new simulation methodologies for sign-off analysis.
  • Perform SI/PI simulations on substrates, packages, flex, and PCBs.

What we're looking for

  • BS in Electrical Engineering or other relevant field of interest.
  • Experience in high speed signal and/or PDN fundamentals.
  • Experience in mainstream tool chain e.g. HFSS, SI-Wave/PSI, Q3D, CST and/or ADS.
  • MS/PhD in Electrical Engineering or other relevant field of interest with industry experience (preferred).
  • Academic or industry exposure to camera or SI/PI technical areas and/or electro-magnetic concepts (preferred).
  • Experience running substrate, package, flex, and/or PCB level SI/PI simulations (preferred).
  • Comfortable handling VNA, TDR, and/or Oscilloscope in academic or professional settings (preferred).
  • Academic knowledge or experience with image sensor or camera module (preferred).

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