ASIC Implementation Engineer

Broadcom

Confirmed live today High trust

Quick summary

Work type
On-site
Location
San Jose, CA
Employment
Full-time
Posted
127 days ago
Freshness
Confirmed live today
Closes
Dec 19, 2026

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Salary context

How this pay compares to similar roles

Similar $193k
$141k $240k
below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $168,175–$217,500.

Based on 240 similar postings.

Employer

About Broadcom

Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software

Broadcom currently has 280 open roles on FindRole.

Listed pay typically runs $121,900–$195,000 across 169 roles with salary data.

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At a glance

TL;DR · ASIC Implementation Engineer

The ASIC Implementation Engineer joins the Asic Products Division to work on next generation Artificial Intelligence and PCIe Switch Products. This role involves taking RTL to silicon tape-out by owning chip floor planning, partition creation, clock tree delivery, and top level partitions. The engineer will resolve physical design issues related to chip integration and assembly while managing cross functional interactions for I/O and bump planning with the package team. Key responsibilities include developing floorplan implementation methodologies and performing technical evaluations of vendors and IP. Required skills include expertise in die size estimate, partitioning, clocking, and pin planning for technologies like Switch Fabric, SerDes, and HBM. Candidates must use scripting languages like Python, Tcl, or Perl along with various EDA tools to manage DRC, LVS, and EMIR issues.

What you'll do

  • Own chip floor planning, partition creation, and the delivery of top-level partitions.
  • Manage clock tree synthesis and delivery for top-level partitions.
  • Resolve physical design issues related to chip integration and assembly.
  • Coordinate with the package team on top-level floorplanning, I/O, and bump planning.
  • Develop and improve floorplan implementation methodologies using industry and internal tools.
  • Perform technical evaluations of vendors and IP to meet design specifications.
  • Resolve chip-level DRC, LVS, and EMIR issues for advanced nodes.

What we're looking for

  • In-depth knowledge and expertise in all Physical Design aspects of taking RTL to silicon tape-out.
  • Experience in chip floor planning, partition creation, clock tree, and top level partition delivery.
  • Ability to resolve physical design issues related to chip integration and assembly.
  • Experience in developing and improving floorplan implementation methodologies using industry and internal tools.
  • Experience performing technical evaluations of vendors and IP to meet design specifications.
  • Bachelor's in Electrical Engineering and 12+ years of experience in top level floorplanning (preferred).
  • Master's degree in Electrical Engineering and 10+ years of experience in top level floorplanning (preferred).
  • Experience with scripting languages like Python, Tcl, or Perl and EDA tools (preferred).

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