below marketmost similar roles pay hereabove market
This role pays more than
62%
of similar roles. Most pay
$162,000–$216,250
— the blue band above.
At the midpoint, this role pays about
$206k
versus about
$189k
for comparable roles.
Based on 240 similar postings.
Employer
About Cisco
Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity
Cisco currently has
300 open roles
on FindRole.
Listed pay typically runs
$167,700–$245,000
across 223 roles with salary data.
As an ASIC Failure Analysis Engineer within the Quality and Reliability group, you will perform root cause failure analysis on silicon product reliability test and field failures. You will collaborate with Product Test, Design, Quality, Assembly, and Foundry Engineering teams to identify and characterize faults on emerging technologies. Your daily responsibilities include developing standard processes for failure analysis, coordinating logistics, and documenting results for management. You will utilize a variety of semiconductor techniques including cross section, X-ray, CSAM, TDR, FIB, SEM, TEM, IR/EMMI/OBIRCH, SIL, and LSM. Additionally, you will perform fault isolation using ATE, Scan/ATPG, and MBIST. This role requires deep knowledge of transistor function, semiconductor device physics, and JEDEC IC Qualification tests to solve complex yield and reliability problems.
Conduct root cause failure analysis on silicon product reliability test and field failures.
Propose corrective actions based on identified failure causes.
Develop and implement standard processes for failure analysis using all types of equipment.
Coordinate logistics and instructions to direct the failure analysis process systematically.
Document and report failure analysis results to management.
Serve as a technical resource for failure analysis questions.
Develop and maintain relationships with failure analysis service and equipment vendors.
Interface with engineering groups to identify and characterize faults on emerging technologies.
What we're looking for
Bachelor's degree in Electrical/Electronics Engineering or related field required.
Master's degree preferred.
8+ years of experience in the semiconductor failure analysis field.
Experience writing and executing FA plans and interpreting results from techniques such as cross section, X-ray, CSAM, TDR, FIB, SEM, TEM, and IR/EMMI/OBIRCH.
Validated ability to specify hardware and implement setup for dynamic FA using SIL and LSM.
Prior experience of fault isolation techniques using ATE, Scan/ATPG, and MBIST to identify and characterize device-level faults.
Semiconductor technology and process knowledge (Fab, Assembly, and Advanced Packaging) (preferred).
Proficient in ATE docked dynamic fault isolation using LVP, LVI/SMI, LADA, and TIVA techniques (preferred).
ASIC
Semiconductor Engineering
Failure Analysis
HTOL
HAST
ESD
Latch-up
SEM
TEM
FIB
EMMI
OBIRCH
X-ray
ATE
Electrical Characterization
Statistical Data Analysis
Chiplets
IC Test Methodologies
Physical Failure Analysis
SEM
TEM
FIB
IC Fabrication
Advanced Packaging
De-processing
Cross-sectioning
Electron Microscopy
Design of Experiments
Root-Cause Analysis
Silicon Architecture
Plasma De-processing
Failure Analysis
SEM
TEM
FIB
IC Fabrication
Advanced Packaging
Electron Microscopy
Design of Experiments
Plasma De-processing
Cross-sectioning
De-layering
Root-Cause Analysis
Physical Characterization