Advanced Lead Engineer, RF Microsystems

GE Aerospace

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Quick summary

Work type
On-site
Location
Niskayuna, NY
Salary
$112,000–$186,000 / yr
Employment
Full-time
Posted
4 days ago
Freshness
Confirmed live today

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $183k
This role $149k
$99k $230k
below market most similar roles pay here above market

This role pays less than 74% of similar roles. Most pay $148,500–$217,500 — the blue band above. At the midpoint, this role pays about $149k versus about $183k for comparable roles.

Based on 240 similar postings.

Employer

About GE Aerospace

GE Aerospace (General Electric Aerospace) designs and produces commercial and military jet engines, components, and integrated systems for aircraft manufacturers and airlines worldwide. Industry: Aerospace & Aviation Engines

GE Aerospace currently has 44 open roles on FindRole.

Listed pay typically runs $130,000–$173,000 across 22 roles with salary data.

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View all roles at GE Aerospace

At a glance

TL;DR · Advanced Lead Engineer, RF Microsystems

The Advanced Lead Engineer - RF Microsystems joins the Microsystems team at GE Aerospace Research to develop and integrate advanced RF microsystems into aerospace products. This role involves working with a multidisciplinary team of scientists and engineers to design and test solutions for harsh environment RF sensing, mmWave communications, and THz spectroscopy. Key responsibilities include designing active and passive RF electronic structures, performing wafer-level and module-level testing, and collaborating with industrial, DoD, and academic partners. Candidates must utilize simulation tools such as Ansys HFSS, CST Studio Suite, ADS, Sonnet, and Momentum. The position requires expertise in RF circuit fabrication, precision analog circuits like amplifiers and ADC/DAC interfaces, and statistical analysis to achieve low Size Weight and Power solutions for complex aerospace sensing problems.

What you'll do

  • Design and test RF Microsystem solutions for harsh environment RF sensing.
  • Develop low Size Weight and Power (SWaP) solutions for aerospace products.
  • Use state-of-the-art simulation software to design and test RF circuits.
  • Perform wafer-level and module-level testing of RF electronic structures.
  • Build RF Microsystem solutions tailored to specific customer needs.
  • Collaborate with industrial, DoD, and academic partners on system-level solutions.
  • Communicate project status updates to key stakeholders inside and outside the company.

What we're looking for

  • Must have a PhD in a relevant Engineering discipline with at least 3 years of related experience.
  • Must have an MS degree in a relevant Engineering discipline with at least 5 years of related experience.
  • Must have demonstrated experience designing and testing active and passive RF electronic structures and devices.
  • Must have demonstrated ability to design, simulate, fabricate, and test RF circuits.
  • Must have demonstrated experience with RF simulation tools like Ansys HFSS, CST Studio Suite, ADS, Sonnet, and Momentum.
  • Must be a U.S. Citizen to meet the prerequisite for obtaining and maintaining a U.S. Government Security Clearance.
  • Must be a U.S. Person (citizen, lawful permanent resident, asylee, or refugee) to access U.S. export-controlled information.
  • Must be willing to work out of an office located in Niskayuna, NY.

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