Thermal Principal Engineer

Dell Technologies

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Franklin, MARound Rock, TX
Salary
$164,000–$226,000 / yr
Posted
4 days ago
Freshness
Confirmed live yesterday
Closes
Jan 31, 2027

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $204k
This role $195k
$128k $290k
below market most similar roles pay here above market

This role pays less than 65% of similar roles. Most pay $177,750–$231,000 — the blue band above. At the midpoint, this role pays about $195k versus about $204k for comparable roles.

Based on 240 similar postings.

Employer

About Dell Technologies

Dell Technologies is a US-based technology company that designs and sells PCs, servers, storage and networking hardware, along with related software and IT services. Its product lines include the XPS, Latitude and Alienware PCs and the PowerEdge server and PowerStore storage families.

Dell Technologies currently has 116 open roles on FindRole.

Listed pay typically runs $176,000–$240,790 across 105 roles with salary data.

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At a glance

TL;DR · Thermal Principal Engineer

The Thermal Principal Engineer joins the Network Engineer Hardware team to lead the thermal architecture, design, and validation of next-generation Network Switches and integrated rack solutions. This role involves developing innovative cooling solutions for high-performance networking platforms supporting AI, HPC, and cloud workloads. You will collaborate across mechanical, electrical, hardware, power, and system engineering teams to evaluate product concepts, drive feasibility assessments, and optimize system performance and reliability. Key responsibilities include developing thermal solutions such as heat sinks, cold plates, air movers, and thermal interface materials. Required skills include a degree in Mechanical Engineering, CFD modeling for internal flow and electronic cooling, and experience instrumenting thermal tests. Desirable expertise includes CREO, air and liquid cooling for server electronics, and cooling requirements for GPUs, CPUs, or NPUs.

What you'll do

  • Lead the thermal architecture, design, and validation for next-generation network switches and integrated rack solutions.
  • Develop innovative cooling solutions for high-performance networking platforms supporting AI, HPC, and cloud workloads.
  • Perform thermal simulations, laboratory testing, and data-driven analysis to evaluate product concepts and feasibility.
  • Optimize system performance, reliability, and efficiency through rigorous thermal characterization.
  • Own key thermal technologies and roadmaps for networking, optics, and rack-scale infrastructure.
  • Design hardware components including heat sinks, cold plates, air movers, and thermal interface materials.
  • Present technical findings to management to identify design improvements for cost, power, and cooling efficiency.
  • Establish and improve product development practices and procedures for thermal engineering.

What we're looking for

  • BS or Master’s degree in Mechanical Engineering with a focus on thermal engineering.
  • At least 8 years of relevant industry experience.
  • Experience in CFD modelling for internal flow and electronic cooling applications.
  • Proven experience instrumenting thermal tests and test plans.
  • Strong communication skills with multi-disciplinary teams to achieve optimal thermal solutions.
  • Experience working with CREO (preferred).
  • Experience with air and liquid cooling in the server or network electronics industry (preferred).
  • Knowledge of cooling requirements for GPUs, CPUs, NPUs, or rack L11 (preferred).

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