Staff Engineer, Thermal

Qualcomm

Confirmed live today High trust

Quick summary

Work type
On-site
Location
San Diego, CA
Salary
$160,200–$240,200 / yr
Posted
22 days ago
Freshness
Confirmed live today
Closes
Apr 3, 2027

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $210k
This role $200k
$149k $266k
below market most similar roles pay here above market

This role pays less than 57% of similar roles. Most pay $182,500–$236,975 — the blue band above. At the midpoint, this role pays about $200k versus about $210k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 575 open roles on FindRole.

Listed pay typically runs $147,900–$221,900 across 550 roles with salary data.

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At a glance

TL;DR · Staff Engineer, Thermal

Staff Engineer, Thermal joins the Packaging Engineering team to address complex thermal challenges for the Qualcomm Dragonfly AI300 platform and future AI computing systems. The role involves leading thermal architecture solutions, performing simulations from silicon to data center environments, and conducting laboratory tests to validate models. Key responsibilities include driving strategy discussions, performing thermal design reviews, and analyzing results to ensure performance, efficiency, and reliability. Candidates must utilize computational fluid dynamics tools like ANSYS Icepak, Celsius EC, or Flotherm, alongside programming languages such as Python, C/C++, or MATLAB. Expertise in thermal interface materials, heat sinks, vapor chambers, and 2.5D or 3D package architectures is required. The position focuses on solving high-power cooling problems for processors, GPUs, and AI accelerators using air, liquid, or hybrid cooling technologies.

What does a Engineer earn in California?

Median $199500 from 103 postings across 31 companies.

See salary data

What you'll do

  • Lead thermal architecture solutions through simulation and test across various stakeholders.
  • Perform thermal simulations using CFD tools from silicon to data center environments.
  • Drive strategy discussions and conduct thermal design reviews and presentations.
  • Conduct thermal tests to validate and characterize models.
  • Analyze and document simulation and test results.
  • Correlate simulation models with empirical test results to improve model accuracy.

What we're looking for

  • Bachelor's degree in Chemical, Electrical, or Mechanical Engineering and 4+ years of System/Package Design/Technology Engineering experience.
  • Master's degree in Chemical, Electrical, or Mechanical Engineering and 3+ years of System/Package Design/Technology Engineering experience.
  • PhD in Chemical, Electrical, or Mechanical Engineering and 2+ years of System/Package Design/Technology Engineering experience.
  • 6+ years of industry experience in electronics cooling for high-performance computing, AI, or data center products (preferred).
  • Experience developing thermal solutions for high-power processors, GPUs, or AI accelerators using air, liquid, or hybrid cooling (preferred).
  • Deep understanding of thermal management technologies including TIMs, heat spreaders, heat sinks, vapor chambers, and heat pipes (preferred).
  • Proficiency in CFD analysis using tools such as ANSYS Icepak, Celsius EC, or Flotherm (preferred).
  • Proficiency in scripting and programming for data analysis using Python, C/C++, or MATLAB (preferred).

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