below marketmost similar roles pay hereabove market
This role pays more than
82%
of similar roles. Most pay
$177,900–$236,517
— the blue band above.
At the midpoint, this role pays about
$262k
versus about
$207k
for comparable roles.
Based on 240 similar postings.
Employer
About Qualcomm
Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.
Qualcomm currently has
594 open roles
on FindRole.
Listed pay typically runs
$147,900–$219,400
across 568 roles with salary data.
The Principal Thermal Engineer joins the Packaging Engineering team to address complex thermal challenges for the Qualcomm Dragonfly AI300 platform and future AI computing systems. This role involves leading thermal architecture solutions, performing simulations from silicon to data center environments, and conducting laboratory tests to validate models. The engineer will drive strategy discussions, perform thermal design reviews, and analyze results to ensure performance and reliability. Key technical requirements include proficiency in computational fluid dynamics (CFD) tools like ANSYS Icepak, Celsius EC, or Flotherm, alongside scripting in Python, C/C++, or MATLAB. Candidates must understand thermal interface materials, heat sinks, vapor chambers, and 2.5D or 3D package architectures. The work focuses on cooling high-power processors, GPUs, and AI accelerators within high-performance computing and data center environments.