Process Engineering Intern

Lam Research

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Fremont, CA
Employment
Intern
Posted
3 days ago
Freshness
Confirmed live yesterday
Closes
Mar 30, 2027

Market check

Salary context

How this pay compares to similar roles

Similar $156k
$91k most similar roles pay here $221k

This listing doesn't post a salary. Most similar roles pay $104,000–$208,200.

Based on 240 similar postings.

Employer

About Lam Research

Lam Research Corporation is a leading American supplier of wafer-fabrication equipment and services to the global semiconductor industry.

Lam Research currently has 141 open roles on FindRole.

Listed pay typically runs $119,000–$261,000 across 88 roles with salary data.

Most-posted roles

View all roles at Lam Research

At a glance

TL;DR · Process Engineering Intern

Summer 2027 - Process Engineering Intern - PhD will join the Patterning Technology team within the Office of Chief Technical Officer to support EUV patterning process development. This role involves operating semiconductor wafer processing equipment in laboratory and clean-room environments while performing testing, characterization, and material analysis for new processes. The intern will plan and execute feasibility studies regarding thin film deposition, etching processes, chemistries, and materials. Key responsibilities include analyzing experimental data, conducting literature reviews, and presenting findings to cross-functional teams. Candidates should possess a PhD in Material Science, Chemical Engineering, or Chemistry with experience in cleanroom settings, thin films, and semiconductor patterning. Preferred skills include proficiency in plasma processes, troubleshooting methodologies like DOE and 8D, and familiarity with analytical tools such as SEM, TEM, XPS, AFM, ellipsometry, and SIMS for characterizing wafer performance.

What you'll do

  • Operate semiconductor wafer processing equipment in laboratory and clean-room environments.
  • Perform testing and characterization for the development of new processes.
  • Run experiments and operate wafer process tools in application labs.
  • Conduct chemistry and material analysis using metrology tools to measure wafer performance.
  • Plan and execute feasibility studies for novel EUV patterning, thin film deposition, and etching processes.
  • Analyze experimental test data and present findings to cross-functional teams.
  • Perform R&D support activities including literature reviews on relevant research topics.

What we're looking for

  • Must be a PhD graduate student in Material Science & Engineering, Chemical Engineering, Chemistry, or related majors.
  • Understanding of chemical mechanisms in semiconductor wafer processing.
  • Hands-on experience in a cleanroom or laboratory setting working with thin films, semiconductor patterning, or solid-state materials.
  • Strong writing and verbal communication skills including proficiency in PowerPoint.
  • Experience with plasma process of depositing and etching of thin films (preferred).
  • Understanding of problem-solving and troubleshooting techniques such as DOE, 5-why, 8D, fishbones, etc. (preferred).
  • Experience working on troubleshooting processing equipment and systems (preferred).
  • Experience with thin film analytical methods such as SEM/TEM, XPS, AFM, ellipsometry, SIMS (preferred).

More like this

Similar roles

Process Engineer IV

Lam Research

Fremont, CA 14 days ago $104,000–$231,000
Statistical Process Control Design of Experiments MATLAB Python JMP Minitab Atomic Layer Deposition Chemical Vapor Deposition Physical Vapor Deposition Reactive Ion Etching Atomic Layer Etching Inductively Coupled Plasma Capacitively Coupled Plasma Material Characterization Surface Engineering
6+ yrs exp

Process Engineer IV

Lam Research

Fremont, CA 69 days ago $104,000–$231,000
Atomic Layer Deposition (ALD) Chemical Vapor Deposition (CVD) Physical Vapor Deposition (PVD) Reactive Ion Etching (RIE) Atomic Layer Etching (ALE) Inductively Coupled Plasma (ICP) Capacitively Coupled Plasma (CCP) Statistical Process Control (SPC) Design of Experiments (DOE) MATLAB Python JMP Minitab Material Characterization Surface Engineering
6+ yrs exp

Product Engineer V

Lam Research

Fremont, CA 79 days ago $125,000–$270,000
Statistical Process Control JMP Origin MiniTab FMEA RCCA Microsoft Excel SEM CDSEM Ellipsometry Optical Defect Inspection RF Power Delivery Plasma Processing Lithography Dry Etch Deposition CMP Material Science Chemical Engineering
10+ yrs exp Hybrid

Product Engineer IV

Lam Research

Fremont, CA 177 days ago $104,000–$231,000
Robotics Mechatronics SPC DOE FMEA Root Cause Analysis 8D 5Why GD&T Etch Deposition Clean Product Design
8+ yrs exp Hybrid

PhD AI Engineering Intern

Amd

Santa Clara, CA 11 days ago $91,520–$137,280
Python PyTorch Artificial Intelligence LLMs Machine Learning Compiler Benchmarking Hardware Optimization AI Agents Computer Systems Experiment Tracking
Hybrid

PhD AI Engineering Intern

Capital One Financial

New York, NY +2 27 days ago
Python Go Scala Java AWS PyTorch LangChain LangGraph LlamaIndex Autogen LLM Inference NLP Computer Vision GenAI Claude Code Windsurf Search and Retrieval
Hybrid