Silicon Technology Research and Development Hardware Engineering Intern

IBM

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Quick summary

Work type
On-site
Location
Albany
Employment
Intern
Posted
48 days ago
Freshness
Confirmed live today

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Salary context

How this pay compares to similar roles

Similar $178k
$123k $236k
below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $133,873–$223,000.

Based on 240 similar postings.

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About IBM

IBM is a US-based global technology company providing hybrid cloud, AI, consulting, enterprise software, and IT infrastructure products and services.

IBM currently has 253 open roles on FindRole.

Listed pay typically runs $174,056–$216,000 across 10 roles with salary data.

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At a glance

TL;DR · Silicon Technology Research and Development Hardware Engineering Intern

As a Silicon Technology Research and Development Hardware Engineering Intern 2027, you will join a team focused on investigating the feasibility of applying science and engineering principles toward innovative hardware design and applications. Your day-to-day responsibilities involve analyzing complex problems and applying creative solutions to groundbreaking hardware engineering projects. You will work across the full lifecycle of hardware development, including state-of-the-art chip architecture, design, fabrication, and test, as well as advanced chip packaging. The role requires a strong background in engineering disciplines, computer science, physics, or materials science. You will utilize these core competencies to solve technical problems within the domain of semiconductor technology, specifically focusing on the research and development of next-generation hardware components and integrated systems.

What you'll do

  • Investigate the feasibility of applying science and engineering principles to new hardware designs.
  • Analyze complex problems to develop creative solutions for groundbreaking hardware engineering projects.
  • Evaluate state-of-the-art chip architecture and design possibilities.
  • Assess fabrication and test methodologies for new hardware applications.
  • Research advanced chip packaging technologies and applications.
  • Apply knowledge of physics, materials science, or computer science to hardware development.

What we're looking for

  • Background knowledge of engineering disciplines, computer science, physics, or materials science (preferred).
  • Ability to analyze complex problems and apply creative solutions to groundbreaking hardware engineering projects.
  • Ability to investigate the feasibility of applying science and engineering principles towards innovative hardware design and applications.

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