The Silicon Technology Research and Development Hardware Engineering Intern 2027 role is situated within the IBM Research team, where you will work alongside global researchers focused on next-generation chips and systems. You will investigate the feasibility of applying science and engineering principles toward innovative hardware design and applications, spanning state-of-the-art chip architecture, design, fabrication, test, and advanced chip packaging. The role requires a background in electrical engineering, mechanical engineering, computer science, materials engineering, physics, or chemistry. Candidates should possess the ability to analyze complex problems and provide creative solutions for groundbreaking projects. This position addresses technical challenges in logic and memory technology to support applications such as quantum silicon and artificial intelligence. Preferred qualifications include specific knowledge of semiconductor fabrication or related coursework to solve critical hardware engineering problems in high-performance computing environments.
Data Science
Machine Learning
High Performance Computing
Quantum Computing
Hybrid Cloud
Chip Architecture
Semiconductor Research
Data Analysis
Information Technology
SolidWorks
Cadence
Allegro
Python
C++
Bash
MATLAB
LabVIEW
AutoCAD
HFSS
CFD
FEM
PCB Layout
EDA
Circuit Design
Signal Integrity
Power Integrity
Test Automation
Design of Experiments (DOE)