Senior Quantum Package & Motherboard Engineer

Microsoft

Quick summary

Work type
On-site
Location
Redmond, WA
Salary
$119,800–$234,700 / yr
Posted
4 days ago
Closes
Dec 20, 2026

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $193k
This role $177k
$106k most similar roles pay here $248k

This role pays more than 54% of similar roles. Most pay $170,000–$216,250 — the shaded band above. At the midpoint, this role pays about $177k versus about $193k for comparable roles.

Based on 240 similar postings.

Employer

About Microsoft

Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing

Microsoft currently has 622 open roles on FindRole.

Listed pay typically runs $119,800–$234,700 across 571 roles with salary data.

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At a glance

TL;DR · Senior Quantum Package & Motherboard Engineer

As a Senior Quantum Package & Motherboard Engineer at our cutting-edge quantum technology firm, you will join a multidisciplinary team of experts to innovate and scale complex cryogenic hardware solutions. Your primary responsibilities include developing robust packaging and motherboard design processes for quantum devices, collaborating with vendors to source materials, and designing PCBs tailored for extreme cold environments. You will simulate components for signal and power integrity, manage manufacturing readiness, and ensure seamless integration across various engineering disciplines. This role demands proficiency in electrical engineering, AI-driven innovation, and expertise in analog signal, power integrity, and signal integrity simulations. With a background in silicon package design and PCB development, you will work on cryo-temperature logic systems, driving efficiency through advanced tools and methodologies while fostering an inclusive culture that values collaboration and mentorship.

What you'll do

  • Develop and maintain robust packaging and motherboard design processes for quantum devices.
  • Design and drive external material vendors to deliver solutions for quantum device packaging.
  • Simulate packaging/motherboard components for signal and power integrity.
  • Own signaling chain specifications from room temperature to cryogenic logic temperatures.
  • Improve electrical and PCB development processes, documentation, and validation workflows.
  • Communicate engineering input into decision frameworks across technical and executive audiences.
  • Mentor junior engineers while reinforcing inclusive culture and values.

What we're looking for

  • 10+ years of experience in Silicon Package Design and PCB Design.
  • Successfully delivered Silicon Packages and Motherboards into production.
  • Proficient in industry-standard tools/methodologies for Package and PCB Design.
  • Expertise in Analog Signal, Power Integrity & Signal Integrity simulations.
  • Experience with cryogenic temperatures in Package, Motherboard designs.
  • Ability to leverage AI for innovation and efficiency in design processes.
  • Strong interpersonal skills and experience working with external partners.

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