Senior Quantum Materials UHV Hardware Engineer
Microsoft
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How this pay compares to similar roles
This role pays more than 54% of similar roles. Most pay $170,000–$216,250 — the shaded band above. At the midpoint, this role pays about $177k versus about $193k for comparable roles.
Based on 240 similar postings.
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Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing
Microsoft currently has 622 open roles on FindRole.
Listed pay typically runs $119,800–$234,700 across 571 roles with salary data.
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At a glance
As a Senior Quantum Package & Motherboard Engineer at our cutting-edge quantum technology firm, you will join a multidisciplinary team of experts to innovate and scale complex cryogenic hardware solutions. Your primary responsibilities include developing robust packaging and motherboard design processes for quantum devices, collaborating with vendors to source materials, and designing PCBs tailored for extreme cold environments. You will simulate components for signal and power integrity, manage manufacturing readiness, and ensure seamless integration across various engineering disciplines. This role demands proficiency in electrical engineering, AI-driven innovation, and expertise in analog signal, power integrity, and signal integrity simulations. With a background in silicon package design and PCB development, you will work on cryo-temperature logic systems, driving efficiency through advanced tools and methodologies while fostering an inclusive culture that values collaboration and mentorship.
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