Senior Electrical Engineer

What you'll do

• Define and own the electrical architecture for EO/IR sensor payload assemblies, including power distribution and communication interfaces.
• Design and test isolated power conversion, EMI filtering, and over-voltage protection circuitry for low-voltage DC systems.
• Select connectors and perform wire/cable derating analyses to establish shielding and bonding schemes for EMI/EMC requirements.
• Design high-speed Ethernet and discrete I/O interfaces between sensor electronics and host avionics.
• Select radiation-tolerant components and perform EEE parts stress and reliability analyses for space environments.
• Execute test procedures using oscilloscopes and network analyzers to validate designs against functional requirements.
• Integrate electrical designs into sensor payload assemblies through hardware/software bring-up and verification testing.

What we're looking for

• A Bachelor's in Electrical Engineering or a related technical field is typically required.
• 8+ years of experience designing power, interface, or mixed-signal electronics for space, airborne, or other harsh-environment defense systems.
• Experience designing isolated DC/DC power conversion, EMI filters, and transient/over-voltage protection circuits for low-voltage DC systems.
• Familiarity with MIL-STD-461 and MIL-STD-464 (or equivalent) EMI/EMC design and test methods.
• Experience with connector selection, pin/harness definition, and parts/wire derating analysis (e.g., per MIL-HDBK-1547A or equivalent).
• Strong hardware debugging skills using standard lab equipment like oscilloscopes, multimeters, and logic/protocol analyzers.
• Proficiency with schematic capture/circuit simulation tools and worst-case stress/derating analysis.
• US Person status is required to access export-controlled data.
• Eligible to obtain and maintain an active U.S. Secret security clearance.
• Experience designing radiation-tolerant electronics and performing TID/SEU analysis for space systems (preferred).
• Experience with high-speed digital/communication interfaces (10GbE, SERDES) and signal integrity analysis (preferred).
• Familiarity with machine-vision/sensor communication protocols (e.g., GigE Vision) (preferred).
• Experience with hybrid microelectronics packaging (MIL-PRF-38534) or similar high-reliability component standards (preferred).
• PCB layout experience (e.g., Altium, Cadence) for mixed-signal or RF boards (preferred).
• Familiarity with electro-optical/infrared sensor payload electronics (detector bias/readout, cryocooler drive electronics) (preferred).
• Familiarity with embedded Linux/firmware interfaces to support electronics bring-up (preferred).