below marketmost similar roles pay hereabove market
This role pays more than
78%
of similar roles. Most pay
$138,000–$215,000
— the blue band above.
At the midpoint, this role pays about
$218k
versus about
$176k
for comparable roles.
Based on 240 similar postings.
Employer
About Broadcom
Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software
Broadcom currently has
279 open roles
on FindRole.
Listed pay typically runs
$121,900–$195,000
across 168 roles with salary data.
The R&D Engineer will join the team to serve as a technical lead for multi-chip semiconductor assembly and system pathfinding for leading-edge artificial intelligence and high-performance computing modules. The role involves owning key portions of the advanced packaging and assembly technology roadmap, driving development from early R&D through new product introduction, and providing hands-on applications support. Responsibilities include defining technology requirements, performing risk assessments, and managing projects from concept to high-volume manufacturing. The candidate must utilize expertise in advanced packaging, system in package assembly, thermal solutions, power delivery, and electrical and optical communication. Required skills include proficiency with statistical data analysis tools, yield failure mechanisms like EFA and PFA, and thermal and stress simulation tools to solve complex semiconductor fabrication and reliability issues.
Lead multi-chip semiconductor assembly and system pathfinding for AI and high-performance computing modules.
Own and drive the development of advanced packaging and assembly technology roadmaps from R&D to production.
Translate system-level performance requirements into specific module requirements and technology roadmaps.
Manage new technology projects independently from the concept phase through high-volume manufacturing transfer.
Provide hands-on applications support and technical problem-solving as technologies transition from R&D to product development.
Coordinate cross-functional technology risk assessments and mitigation strategies for multiple parallel projects.
Collaborate with external foundries and OSATs to identify and develop candidate packaging technologies.
Perform root cause analysis on yield failure mechanisms using EFA and PFA tools.
What we're looking for
MSEE in Electrical Engineering or related field and 15+ years of experience in semiconductor process technology, advanced packaging, and manufacturing.
PhD and 12+ years of experience in semiconductor process technology and manufacturing, specifically in R&D and integration roles.
Expertise in advanced packaging technology, system in package assembly, and semiconductor device fabrication and operation.
Experience with design of serial and parallel interfaces for chip-to-chip and external module communication.
Proficiency with statistical data analysis tools and experience with parametric and yield data analysis.
Experience with yield failure mechanisms and tools for root cause finding such as EFA and PFA.
Experience with thermal and stress simulation tools.
Exceptional data analysis, problem solving, and interpersonal skills.
Silicon Photonics
Semiconductor Characterization
Failure Analysis
JMP
Python
R
MATLAB
Design for Reliability
Design for Test
Statistical Analysis
IC Packaging
Wafer Fabrication
Fiber Optics
Change Management
PPQ
Database Development
Semiconductor Technology
Advanced Packaging
Design for Manufacturing (DFM)
Design for Yield (DFY)
Material Science
Thin Film Process Development
Yield Improvement
Test Vehicle Design
Process Definition
Architecture Definition
Foundry
OSAT
Semiconductor Technology
Advanced Packaging
DFM
DFY
Material Science
Thin Film Process Development
Yield Improvement
Test Vehicle Design
Process Definition
Architecture Definition
Manufacturing
Foundry
OSAT