This role pays more than
88%
of similar roles. Most pay
$131,625–$197,500
— the shaded band above.
At the midpoint, this role pays about
$218k
versus about
$165k
for comparable roles.
Based on 240 similar postings.
Employer
About Broadcom
Broadcom is a global semiconductor and infrastructure software company that designs and markets a wide range of networking, storage, and wireless connectivity solutions. Industry: Semiconductors & Infrastructure Software
Broadcom currently has
119 open roles
on FindRole.
Listed pay typically runs
$121,900–$195,000
across 105 roles with salary data.
As an R&D Engineer, you will serve as the technical lead for multi-chip semiconductor assembly and system pathfinding specifically for leading-edge artificial intelligence and high-performance computing modules. You will own key portions of the advanced packaging and assembly roadmap, driving new technology from early research through product introduction by collaborating with internal design teams and external foundry partners. Your daily work involves translating system requirements into modules, defining qualification plans, and performing risk assessments to mitigate issues in manufacturing. The role requires expertise in advanced packaging, system-in-package assembly, thermal solutions, power delivery, and electrical or optical communication. You will utilize statistical data analysis tools, yield failure mechanisms like EFA and PFA, and thermal and stress simulation tools to solve complex problems while managing projects from concept through high-volume manufacturing.