Senior Packaging Engineer, Thermal Materials, AI Satellites

What you'll do

• Own the full lifecycle of advanced packaging through board assembly process development.
• Drive system trades, requirements capture, materials selection, prototyping, and failure analysis.
• Spearhead the development of integrated thermal solutions and next-generation thermal interface materials.
• Manage the full lifecycle of equipment specification, qualification, and manufacturing ramp.
• Build and manage supply chains for dies, packages, components, chemicals, and manufacturing equipment.
• Define incoming acceptance criteria for all components and materials used in satellite compute manufacturing.
• Manage compliance risks to ensure safety and environmental standards are met.
• Mentor and develop engineers by providing technical guidance and project oversight.

What we're looking for

• Bachelor's degree in materials science, mechanical engineering, or a similar discipline.
• 5+ years of experience in microelectronics device research or manufacturing.
• Ability to work extended hours or weekends as needed for mission-critical deadlines.
• Must be a U.S. citizen, national, lawful permanent resident, refugee, asylee, or eligible for required U.S. Department of State authorizations.
• Experience in hardware, robotics, automation, or manufacturing environments (preferred).
• Experience designing tooling, fixtures, or jigs for assembly or test applications (preferred).
• Exposure to scripting or data analysis tools like MATLAB or JMP for process data analysis or automation (preferred).
• Familiarity with manufacturing process development methodologies such as PFMEA, process capability studies, or SPC (preferred).