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$130,291–$188,042.
Based on 240 similar postings.
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About Applied Materials
Applied Materials is the world''s largest supplier of equipment, services, and software for the semiconductor and display industries, enabling the production of chips and advanced displays. Industry: Semiconductor Equipment
Applied Materials currently has
260 open roles
on FindRole.
Listed pay typically runs
$124,000–$171,000
across 192 roles with salary data.
Process Engineer III, Defects Technologist will join a team focused on manufacturing processes for display and semiconductor technologies. The role involves designing and optimizing defect knowledge base frameworks, performing root cause identification, and developing troubleshooting methodologies for various equipment types. You will collect and analyze defect incident data from field operations, curate comprehensive knowledge bases including wafer maps and particle images, and create technical documentation such as case studies and training materials. Key responsibilities include collaborating with cross-functional teams to improve defect reduction solutions and ensuring data integrity across systems. The position requires expertise in semiconductor manufacturing equipment, specifically within Dielectric Deposition, Etch, or Metal Deposition. Candidates should be proficient in analytical tools like SEM, FIB, TEM, and XRD while possessing a deep understanding of particulate transport mechanisms, plasma processes, and vacuum systems to solve complex hardware challenges.
Design and implement defect knowledge base frameworks including root cause identification and failure analysis.
Develop data collection strategies and failure analysis plans in collaboration with subject matter experts.
Validate defect data analysis from field engineers to ensure data integrity and auto-classification accuracy.
Create structured troubleshooting trees and workflows for various equipment types.
Build and curate comprehensive knowledge bases including defect signatures, wafer maps, and particle images.
Analyze service case histories and installed base configurations to identify gaps in product coverage.
Develop training materials, technical documentation, and case studies to support field deployment.
Perform gap analyses of existing troubleshooting capabilities to recommend improvements based on fab requirements.
What we're looking for
Bachelor’s degree in Materials Science, Chemical Engineering, Electrical Engineering, Physics, Chemistry, or a related field.
4–7 years of semiconductor industry experience.
Demonstrated expertise in defect troubleshooting methodologies for semiconductor manufacturing equipment.
Strong analytical and problem-solving skills with experience in complex systems and root cause analysis.
Experience with semiconductor equipment in Dielectric Deposition, Etch, or Metal Deposition (preferred).
Experience working in memory or logic fabs, or in semiconductor equipment hardware/process development (preferred).
Familiarity with advanced analytical and characterization tools such as SEM, FIB, TEM, AFM, EDX, XPS, Auger, XRD, XRF, Raman, FTIR, RGA, OES (preferred).
Knowledge of particulate transport mechanisms, aerosols, plasma processes, and vacuum systems (preferred).
Semiconductor Manufacturing
3D Integration
Advanced Packaging
Metrology
Root Cause Analysis
Material Engineering
Quantum Computing
Hardware Characterization
Process Engineering
Technical Documentation
Deposition
Etch
Epitaxy (EPI)
PVD
Thin Films
Design of Experiments (DOE)
JMP
Minitab
Statistical Process Control
Root-Cause Analysis
Data Analytics
Semiconductor Manufacturing
Process Characterization
Chemical Engineering
Hardware Characterization
Root Cause Analysis
Data Analysis
Oscilloscopes
Spectrum Analyzers
DAQ Systems
Thermal Analysis
Semiconductor Manufacturing
System Integration
Technical Documentation