Principal Product Engineer

Microsoft

Quick summary

Work type
On-site
Location
Salary
$142,800–$274,800 / yr
Posted
8 days ago
Closes
Dec 16, 2026

Market check

Salary context

Above market

How this pay compares to similar roles

Similar $187k
This role $209k
$127k most similar roles pay here $291k

This role pays more than 72% of similar roles. Most pay $163,640–$211,200 — the shaded band above. At the midpoint, this role pays about $209k versus about $187k for comparable roles.

Based on 240 similar postings.

Employer

About Microsoft

Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing

Microsoft currently has 622 open roles on FindRole.

Listed pay typically runs $119,800–$234,700 across 571 roles with salary data.

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At a glance

TL;DR · Principal Product Engineer

The Principal Product Engineer role within the Silicon, Manufacturing, and Packaging Engineering team at Microsoft focuses on driving product engineering from definition to launch for high-performance computing hardware. This includes managing pre-Si readiness for power, performance, thermal, and power delivery tests, optimizing ATE test programs, and ensuring successful post-Si phase tuning in collaboration with platform teams. The ideal candidate will have extensive experience in semiconductor IC development, manufacturing, fabrication, testing, and packaging, along with strong project leadership skills to manage external vendors and cross-functional teams. Key qualifications include a deep understanding of ATE test program development, DFT techniques, silicon fabrication processes, and system validation across various platforms. Experience in high-performance computing, AI, GPUs, CPUs, and familiarity with tools like Advantest V93K is preferred.

What you'll do

  • Drive pre-Si readiness and power-related tests for successful hardware bring-up.
  • Optimize ATE test programs for SOC power/TDP in collaboration with platform/system engineers.
  • Manage product manufacturing fuse requirements and end-to-end data flow across test sockets.
  • Develop and implement DFT, silicon fabrication process knowledge, and basic transistor theory.
  • Lead cross-functional teams to manage external vendors and drive sub-projects within larger development programs.

What we're looking for

  • Doctorate in Electrical Engineering or equivalent experience with 3+ years of technical engineering.
  • Over 10 years of experience in product development and manufacturing for high-performance computing products.
  • Expertise in developing integrated circuits, including pre-silicon and first silicon bring-up phases.
  • Strong background in ATE test program development and optimization for SOC power/TDP.
  • Experience leading cross-functional teams and managing external vendors in IC production.
  • Knowledge of DFT, silicon fabrication process, product Q&R, and basic transistor theory.
  • In-depth understanding of power/performance modelling and yield recovery implementation.

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