Principal IC Design Engineer
Broadcom
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How this pay compares to similar roles
This role pays more than 71% of similar roles. Most pay $157,975–$212,718 — the shaded band above. At the midpoint, this role pays about $209k versus about $185k for comparable roles.
Based on 240 similar postings.
Employer
Microsoft Corporation is a global technology leader producing software, hardware, and cloud services including Windows, Office 365, Azure cloud platform, Xbox gaming, and Surface devices. Industry: Software & Cloud Computing
Microsoft currently has 622 open roles on FindRole.
Listed pay typically runs $119,800–$234,700 across 559 roles with salary data.
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At a glance
The Principal Circuit Design Engineer role within Microsoft’s Custom IP team focuses on delivering high-quality, cost-effective custom IPs that enhance the Azure Cloud's performance. This senior-level position involves collaborating with SoC designers to develop Memory SRAM and Register file solutions for challenging power-performance-area (PPA) issues. The engineer will work closely with process technology teams to optimize advanced processes and devise methodologies for statistical analysis and characterization of timing, power, and EMIR. Key responsibilities include running quality assurance checks on IP collateral, developing characterization plans for testchips, and creating scripting automation for design flows. Ideal candidates have extensive experience in SRAM/Register file design, process technology understanding, and yield/reliability expertise, along with proficiency in PERL, Python, or TCL scripting and AI integration in circuit design tasks.
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