Integrated Photonics Technical Leader

Cisco

Confirmed live today High trust
Hybrid

Quick summary

Work type
Hybrid
Location
Holmdel, NJ
Salary
$171,600–$245,000 / yr
Employment
Full-time
Posted
53 days ago
Freshness
Confirmed live today

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $196k
This role $208k
$147k $255k
below market most similar roles pay here above market

This role pays more than 60% of similar roles. Most pay $164,875–$227,300 — the blue band above. At the midpoint, this role pays about $208k versus about $196k for comparable roles.

Based on 240 similar postings.

Employer

About Cisco

Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity

Cisco currently has 307 open roles on FindRole.

Listed pay typically runs $167,700–$245,000 across 224 roles with salary data.

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At a glance

TL;DR · Integrated Photonics Technical Leader

The Integrated Photonics Technical Leader joins the Photonic Integrated Circuit team to develop advanced photonic chips for high-speed optical communication products. This role involves designing, simulating, laying out, and characterizing integrated photonic components and circuits across silicon photonics, thin-film lithium niobate, and III–V material platforms. You will perform numerical modeling, foundry process development, production tapeouts, and failure analysis to transition designs from initial concepts to high-volume manufacturing. Key responsibilities include creating parameterized GDS layouts, validating electromagnetic and multiphysics simulations, and performing hands-on characterization at the die, wafer, and assembled-device levels. You will utilize tools such as FDTD, HFSS, and COMSOL Multiphysics to solve technical challenges in high-capacity optical interconnects for data centers, subsea networks, and space-based applications.

What you'll do

  • Design passive and active integrated photonic components and high-speed optoelectronic circuits.
  • Develop and validate numerical models using electromagnetic, optical, electrical, and thermal simulation methods.
  • Create parameterized and script-based GDS layouts for photonic components and full product chips.
  • Support foundry process development, mask preparation, design-rule verification, and production tapeouts.
  • Plan and perform hands-on characterization of photonic components at the die, wafer, and assembled-device levels.
  • Analyze measurement data to correlate experimental results with device models and system-level performance.
  • Transition PIC designs from prototype development into qualified commercial products for high-volume manufacturing.
  • Provide technical support during product integration, qualification, and manufacturing ramp.

What we're looking for

  • Bachelor's plus 8 years, Master's plus 6 years, or PhD plus 3 years of related experience is required.
  • Experience in solid-state physics, integrated photonics, optoelectronics, and electromagnetic theory is required.
  • Experience with numerical methods for photonic-device simulation is required.
  • Experience using simulation tools such as FDTD, HFSS, COMSOL Multiphysics, or equivalent platforms is required.
  • Experience with photonic-device fabrication processes and the relationship between fabrication tolerances and device performance is required.
  • Experience with photonic-device layout, GDS generation, design-rule compliance, and tapeout is required.
  • PhD with at least 5 years of relevant industry or applied research experience (preferred).
  • Experience with high-speed electronic-photonic co-design and integrating multiple material platforms (preferred).

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