Integrated Photonics Technical Leader

Cisco

Confirmed live yesterday High trust
Hybrid

Quick summary

Work type
Hybrid
Location
Holmdel, NJ
Salary
$171,600–$245,000 / yr
Posted
7 days ago
Freshness
Confirmed live yesterday

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $197k
This role $208k
$141k most similar roles pay here $256k

This role pays more than 61% of similar roles. Most pay $167,450–$227,350 — the shaded band above. At the midpoint, this role pays about $208k versus about $197k for comparable roles.

Based on 240 similar postings.

Employer

About Cisco

Cisco Systems is the world''s leading networking technology company, designing and manufacturing networking hardware, telecommunications equipment, and cybersecurity solutions for businesses and governments. Industry: Networking Technology & Cybersecurity

Cisco currently has 196 open roles on FindRole.

Listed pay typically runs $167,700–$245,200 across 196 roles with salary data.

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At a glance

TL;DR · Integrated Photonics Technical Leader

Integrated Photonics Technical Leader - Acacia (Hybrid) is a role within the PIC team focused on developing advanced photonic chips for high-speed optical communication products. You will design, simulate, lay out, and characterize integrated photonic components and circuits across silicon photonics, thin-film lithium niobate, and III–V material platforms. Daily responsibilities include numerical modeling using electromagnetic, optical, electrical, thermal, and multiphysics simulation methods like FDTD, HFSS, or COMSOL Multiphysics. You will create GDS layouts, manage foundry process development, perform tapeouts, and conduct hands-on characterization at the die and wafer levels. The role involves solving complex problems in high-capacity optical interconnects for data centers and space-based applications. Key technical requirements include expertise in solid-state physics, optoelectronics, and scripting for automation to transition designs from initial prototypes into qualified products for coherent transceivers and PAM4 systems.

What you'll do

  • Design, simulate, and lay out integrated photonic components and circuits for high-speed optical communication systems.
  • Develop and validate numerical models using electromagnetic, optical, electrical, thermal, and multiphysics simulation methods.
  • Create parameterized and script-based GDS layouts for photonic components and full product chips.
  • Support foundry process development, mask preparation, design-rule verification, and production tapeouts.
  • Perform hands-on characterization of photonic components at the die, wafer, and assembled-device levels.
  • Analyze measurement data to correlate experimental results with device models, process variations, and packaging effects.
  • Transition PIC designs from initial prototype development into qualified commercial products for high-volume manufacturing.
  • Provide technical support during product integration, qualification, and manufacturing ramp processes.

What we're looking for

  • Bachelor's plus 8 years experience, Master's plus 6 years, or PhD plus 3 years of related experience is required.
  • Experience in solid-state physics, integrated photonics, optoelectronics, and electromagnetic theory is required.
  • Proficiency in numerical methods for photonic-device simulation using tools like FDTD, HFSS, or COMSOL Multiphysics is required.
  • Experience with photonic-device fabrication processes, layout, GDS generation, and design-rule compliance is required.
  • A PhD with at least 5 years of relevant industry or applied research experience is preferred.
  • Experience executing large-scale PIC tapeouts through commercial foundries is preferred.
  • Experience designing and testing high-speed optical modulators, photodetectors, or other optoelectronic devices is preferred.
  • Experience with scripting or programming languages for simulation automation and data analysis is preferred.

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