Hardware Intern, Advanced Solder Processes

IBM

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1 day ago
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Confirmed live yesterday

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TL;DR · Hardware Intern, Advanced Solder Processes

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As a Hardware Intern 2027: Advanced Solder Processes at IBM Research, you will join a team focused on high-performance computing to conduct studies of advanced bonding and reflow techniques. Your daily responsibilities involve investigating how different package constructions and bonding reflow methods affect performance while gaining experience in relevant packaging analysis methods. To succeed, you must possess expertise in physics or microelectronics/EE and be proficient in SMT soldering processes. You will use analytical skills to assess the results of solder joints after processing and summarize findings to draw comprehensive conclusions. The role requires a deep understanding of SMT assembly, solder joint evaluation, and the ability to improve connections based on different solder alloys and pure compositions. This work addresses critical technical challenges in advanced packaging for high-performance computing systems.

Skills

SMT Soldering Microelectronics Physics High Performance Computing AI Quantum Computing Hybrid Cloud Solder Joint Evaluation Packaging Analysis Solder Alloys Reflow Techniques

What you'll do

  • Conduct studies on advanced bonding and reflow techniques for high-performance computing applications.
  • Analyze the effects of different package constructions and bonding reflow techniques.
  • Perform packaging analysis methods to evaluate hardware components.
  • Execute SMT soldering processes and manage related assembly workflows.
  • Assess the quality and integrity of solder joints after processing.
  • Optimize solder connections based on various solder alloys and pure compositions.
  • Summarize analytical results and draw comprehensive conclusions from technical data.

What we're looking for

  • High School Diploma or GED.
  • Bachelor's Degree (preferred).
  • Studies in Physics, Microelectronics/EE, or a related discipline.
  • Proficiency in SMT soldering processes.
  • Analytical skills to assess results of solder joints after the solder process.
  • Ability to collaborate within a team on the same project.
  • Advanced studies in Microelectronics/EE or physics (preferred).
  • Deep knowledge of SMT assembly, solder joint evaluation, and alloy composition (preferred).

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