Hardware Developer Engineer Intern, Mechanical

IBM

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Quick summary

Work type
On-site
Location
San Jose, CA
Employment
Intern
Posted
11 days ago
Freshness
Confirmed live today

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Salary context

How this pay compares to similar roles

Similar $166k
$115k $218k
below market most similar roles pay here above market

This listing doesn't post a salary. Most similar roles pay $124,850–$208,075.

Based on 240 similar postings.

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About IBM

IBM is a US-based global technology company providing hybrid cloud, AI, consulting, enterprise software, and IT infrastructure products and services.

IBM currently has 265 open roles on FindRole.

Listed pay typically runs $180,812–$217,000 across 11 roles with salary data.

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At a glance

TL;DR · Hardware Developer Engineer Intern, Mechanical

As a Hardware Developer Engineer Intern (Mechanical) 2027, you will join a multidisciplinary team to design and build hardware platforms for AI, advanced computing, and quantum technologies. You will work on mechanical systems, structures, and technologies for products like IBM zSystems, Power Systems, Storage, and Quantum. Your daily responsibilities include mechanical design of components and assemblies, thermal analysis, structural and vibration analysis, and materials selection. You will perform finite element modeling for multiphysics simulations, manage microelectronics packaging, and conduct system characterization and validation. The role requires expertise in heat transfer modeling, airflow optimization, and DFMA principles. You will collaborate across electrical and firmware domains to ensure manufacturability and reliability while solving complex hardware lifecycle challenges from initial concept through to final product release.

What you'll do

  • Design and develop mechanical components, assemblies, and system-level structures for high-performance hardware.
  • Perform thermal design, heat transfer modeling, and airflow optimization to develop cooling solutions.
  • Conduct structural and vibration analysis, materials selection, and reliability engineering.
  • Execute finite element modeling (FEM/FEA) for mechanical, thermal, and multiphysics simulations.
  • Integrate microelectronics and system-level packaging including processors, memory, and power delivery.
  • Plan and execute system characterization, component testing, and validation protocols.
  • Optimize manufacturability and assembly using tolerance analysis and DFMA principles.
  • Perform root cause analysis for mechanical or environmental issues in field and customer environments.

What we're looking for

  • Must be pursuing a Bachelor's Degree in Mechanical Engineering or a related major.
  • Must have a Bachelor's Degree.
  • Must have prior project or internship experience in computer hardware or testing.
  • Must possess strong verbal and written communication skills.
  • Must demonstrate a passion for technology and engineering.
  • Must possess a Master's Degree (preferred).
  • Must have at least three months of computer or electrical engineering experience in cable assemblies, harnesses, and interconnectivity (preferred).

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