Hardware Developer Intern
IBM
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This listing doesn't post a salary. Most similar roles pay $124,850–$208,075.
Based on 240 similar postings.
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IBM is a US-based global technology company providing hybrid cloud, AI, consulting, enterprise software, and IT infrastructure products and services.
IBM currently has 265 open roles on FindRole.
Listed pay typically runs $180,812–$217,000 across 11 roles with salary data.
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As a Hardware Developer Engineer Intern (Mechanical) 2027, you will join a multidisciplinary team to design and build hardware platforms for AI, advanced computing, and quantum technologies. You will work on mechanical systems, structures, and technologies for products like IBM zSystems, Power Systems, Storage, and Quantum. Your daily responsibilities include mechanical design of components and assemblies, thermal analysis, structural and vibration analysis, and materials selection. You will perform finite element modeling for multiphysics simulations, manage microelectronics packaging, and conduct system characterization and validation. The role requires expertise in heat transfer modeling, airflow optimization, and DFMA principles. You will collaborate across electrical and firmware domains to ensure manufacturability and reliability while solving complex hardware lifecycle challenges from initial concept through to final product release.
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