Senior Staff Hardware Design Engineer

Qualcomm

Confirmed live 2 days ago High trust

Quick summary

Work type
On-site
Location
Austin, TXSan Diego, CA
Salary
$162,600–$244,000 / yr
Posted
28 days ago
Freshness
Confirmed live 2 days ago
Closes
Feb 10, 2027

Market check

Salary context

Competitive pay

How this pay compares to similar roles

Similar $196k
This role $203k
$140k most similar roles pay here $255k

This role pays more than 58% of similar roles. Most pay $168,225–$223,700 — the shaded band above. At the midpoint, this role pays about $203k versus about $196k for comparable roles.

Based on 240 similar postings.

Employer

About Qualcomm

Qualcomm is a leading American semiconductor and telecommunications company based in San Diego, CA.

Qualcomm currently has 623 open roles on FindRole.

Listed pay typically runs $148,300–$222,500 across 603 roles with salary data.

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View all roles at Qualcomm

At a glance

TL;DR · Senior Staff Hardware Design Engineer

Hardware Design Engineer - Sr Staff joins the Cloud System Hardware and Validation Engineering team to develop rack-level AI inference solutions for next-generation liquid-cooled data centers. This role involves designing motherboards, add-in cards, and modules for new AI System On Chip and System In Package technologies. You will lead schematic designs, PCB layouts, component selections, and thermal management while collaborating with cross-functional teams to move projects from concept to production. Key responsibilities include managing rack-level integration of servers and networking switches, resolving architecture issues, and overseeing manufacturing processes. Required expertise includes high-speed serial I/O like PCIe Gen5/6 and 400G Ethernet, as well as experience with LPDDR4x/5x memory and power delivery systems. You will utilize tools such as Cadence Allegro, Mentor Expedition, and SPICE while leveraging oscilloscopes and JTAG for hardware bring-up and debugging.

What you'll do

  • Design and develop motherboards, add-in cards, and modules for new AI System on Chip (SoC) products.
  • Lead schematic design, PCB layouts, component selection, and thermal/mechanical designs for rack-level systems.
  • Co-develop functional specifications for system architectures including memory, I/O, and power delivery.
  • Resolve hardware architecture and design issues across card, system, and rack levels.
  • Perform bring-up and debugging of hardware systems using JTAG tools and high-speed signal analysis.
  • Provide technical oversight of manufacturing processes to ensure quality and consistency for rack-level deployments.
  • Coordinate with ODMs and partners to manage product requirements, technical milestones, and training.

What we're looking for

  • Bachelor's degree in Computer Science, Electrical/Electronics Engineering, or a related field with 6+ years of hardware engineering experience.
  • Master's degree in Computer Science, Electrical/Electronics Engineering, or a related field with 5+ years of hardware engineering experience.
  • PhD in Computer Science, Electrical/Electronics Engineering, or a related field with 4+ years of hardware engineering experience.
  • Experience in rack-level system integration including chassis, backplane, cabling, airflow, and thermal management.
  • Expertise in high-speed serial I/O (6–10+ Gbps), PCIe Gen5/6, LPDDR4x/5x, and 200/400/800 GbE.
  • Proficiency in schematic capture and PCB layout tools such as Cadence Allegro or Mentor Expedition.
  • Experience with circuit simulation tools (SPICE) and hardware measurement instruments like oscilloscopes and logic analyzers.
  • Master's degree, 10+ years of experience, or 4+ years of specific circuit design/tool experience are preferred.

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