GPU Top Level Physical Design Engineer

Apple Inc

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Work type
On-site
Location
Austin, TX
Posted
25 days ago
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Confirmed live today

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Similar $209k
$137k $277k
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About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 3596 open roles on FindRole.

Listed pay typically runs $166,600–$277,600 across 2772 roles with salary data.

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TL;DR · GPU Top Level Physical Design Engineer

The GPU Top Level Physical Design Engineer joins the Silicon Technologies group to design and manufacture next-generation, high-performance, power-efficient GPUs. This role involves implementing complete chip design from netlist to tapeout, focusing on large chip integration and top-level place and route integration. Key responsibilities include developing physical design methodologies, guidelines, and checklists while supervising progress and communicating needs to cross-functional teams. The candidate must possess experience in ASIC integration, specifically floorplanning, clock and power distribution, global signal planning, and hard IP integration. Required technical skills include proficiency with floorplanning tools, P&R flows, global timing verification, and physical design verification flows. The work addresses complex problems in large subsystem designs exceeding 20M gates, involving multi-voltage domains, ESD solutions, and design for yield.

What you'll do

  • Implement complete chip design from netlist to tapeout.
  • Drive physical design aspects early in the design cycle based on RTL.
  • Develop physical design methodologies, guidelines, and best known methods.
  • Serve as the focal point for place and route integration at the top level.
  • Manage floorplanning, clock and power distribution, and global signal planning.
  • Integrate internal and external IP while specifying physical domain requirements.
  • Address design for yield, manufacturability, multi-Vt strategies, and thermal management.
  • Supervise progress and drive execution of back-end design goals.

What we're looking for

  • BS degree and 3 years of relevant experience.
  • Experience with ASIC integration including floorplanning, clock and power distribution, global signal planning, I/O planning, or hard IP integration.
  • Experience with hierarchical design approach, top-down design, budgeting, timing, or physical convergence.
  • Experience with Floorplanning tools, P&R flows, global timing verification, and Physical Design Verification Flows.
  • Experience integrating internal and external vendor IP and specifying physical domain requirements (preferred).
  • Experience with multiple voltage and clock domains, ESD solutions, and mixed signal block integration (preferred).
  • Experience with large subsystem designs over 20M gates at frequencies exceeding 1GHz using new technologies (preferred).
  • Familiarity with Design for Yield, Manufacturability, multi Vt strategies, thermal management, and GPU architecture (preferred).

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