Module Integration Engineer
Samsung Electronics
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How this pay compares to similar roles
This role pays less than 94% of similar roles. Most pay $146,775–$222,000 — the shaded band above. At the midpoint, this role pays about $108k versus about $184k for comparable roles.
Based on 240 similar postings.
Employer
Samsung Electronics is a South Korean multinational corporation and a global leader in technology, specializing in consumer electronics, semiconductors, and home appliances.
Samsung Electronics currently has 84 open roles on FindRole.
Listed pay typically runs $106,000–$200,250 across 78 roles with salary data.
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At a glance
The Experienced Module Integration Engineer joins the 2nm GAAFET team to focus on Front-End-of-Line integration for RPMG and CTSDB modules. This role bridges the gap between unit process development and device performance during the transition from FinFET to Gate-All-Around FET architecture. Responsibilities include monitoring trends, collaborating with etch, CVD, ALD, CMP, and lithography engineers to mitigate risks, and executing Design of Experiments to evaluate how process variations impact electrical performance. The candidate will perform failure analysis using TEM, SEM, AFM, and EDX data while managing large datasets via Python, SQL, Spotfire, and Minitab. Required expertise includes MOSFET physics, advanced metrology, and proficiency in Excel for data manipulation. This role solves critical integration challenges at the intersection of lithography, etch, deposition, and device physics to ensure successful gate stack and contact module manufacturing.
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