Senior Module Integration Engineer

Samsung Electronics

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Taylor, TX
Salary
$106,000–$145,000 / yr
Employment
Full-time
Posted
16 days ago
Freshness
Confirmed live yesterday
Closes
Sep 16, 2027

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $185k
This role $126k
$92k most similar roles pay here $236k

This role pays less than 87% of similar roles. Most pay $147,025–$222,000 — the shaded band above. At the midpoint, this role pays about $126k versus about $185k for comparable roles.

Based on 240 similar postings.

Employer

About Samsung Electronics

Samsung Electronics is a South Korean multinational corporation and a global leader in technology, specializing in consumer electronics, semiconductors, and home appliances.

Samsung Electronics currently has 84 open roles on FindRole.

Listed pay typically runs $106,000–$200,250 across 78 roles with salary data.

Most-posted roles

View all roles at Samsung Electronics

At a glance

TL;DR · Senior Module Integration Engineer

The Senior Module Integration Engineer joins the team to drive improvements in yield, reliability, performance, and product competitiveness. This role involves mitigating production risks from NSPC module related technical issues while collaborating with cross-functional teams and leadership to resolve problems. The engineer will own module integration for specific process flow segments, manage systematic defect and device or parametric yield issues through design of experiments, and oversee critical dimension targeting and variation control. Additionally, the position involves root cause investigations for excursion material and transferring advanced technology nodes from headquarters. Candidates should possess a degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry, along with experience in FEOL related integration or unit process groups. Preferred expertise includes GAA integration or related fab processes to address complex semiconductor manufacturing challenges within the production environment.

What you'll do

  • Drive improvements in product yield, reliability, performance, and overall competitiveness.
  • Mitigate production risks caused by NSPC module related technical issues.
  • Lead projects to resolve systematic defects and device or parametric yield issues.
  • Design experiments and execute team-based actions to improve defect detection.
  • Manage critical dimension targeting and variation control within the module.
  • Conduct root cause investigations for excursion material.
  • Transfer advanced technology nodes from headquarters to local production.

What we're looking for

  • Bachelor’s Degree or higher in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related field.
  • Advanced degrees in a related subject may substitute for fab experience.
  • 7+ years of experience in a FEOL related integration or unit process group.
  • Experience in GAA integration or related fab processes (preferred).
  • Ability to lead projects including design of experiments and execution in a team setting.
  • Capability to perform root cause investigations, critical dimension targeting, and variation control.
  • Authorization to access information subject to U.S. export control laws.

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