Module Integration Engineer

Samsung Electronics

Confirmed live yesterday High trust

Quick summary

Work type
On-site
Location
Taylor, TX
Salary
$95,000–$120,000 / yr
Employment
Full-time
Posted
29 days ago
Freshness
Confirmed live yesterday
Closes
Sep 3, 2027

Market check

Salary context

Below market

How this pay compares to similar roles

Similar $184k
This role $108k
$80k most similar roles pay here $237k

This role pays less than 94% of similar roles. Most pay $146,775–$222,000 — the shaded band above. At the midpoint, this role pays about $108k versus about $184k for comparable roles.

Based on 240 similar postings.

Employer

About Samsung Electronics

Samsung Electronics is a South Korean multinational corporation and a global leader in technology, specializing in consumer electronics, semiconductors, and home appliances.

Samsung Electronics currently has 84 open roles on FindRole.

Listed pay typically runs $106,000–$200,250 across 78 roles with salary data.

Most-posted roles

View all roles at Samsung Electronics

At a glance

TL;DR · Module Integration Engineer

The Experienced Module Integration Engineer joins the Nanosheet/Polycrystalline Gate semiconductor process team to manage module health and FEOL integration for 2nm GAA technology nodes. This role is responsible for driving improvements in yield, reliability, performance, and product competitiveness while mitigating production risks from NSPC module technical issues. The engineer will lead projects involving designs of experiments to resolve systematic defects and parametric yield issues, manage critical dimension targeting, and perform root cause investigations for excursion material. Collaboration with cross-functional teams like FE, MFG, and QR is essential for solving technical problems and transferring advanced technology nodes from headquarters. Candidates should possess a degree in Electrical Engineering, Chemical Engineering, Materials Science, Physics, or Chemistry, along with experience in GAA integration or related fab processes to support the development of next-generation semiconductor manufacturing technologies.

What you'll do

  • Manage module integration for specific segments within the Nanosheet/Polycrystalline Gate process flow.
  • Resolve systematic defects and device/parametric yield issues by leading design of experiments and team projects.
  • Control critical dimension targeting and variation within the assigned module.
  • Conduct root cause investigations for excursion materials to mitigate production risks.
  • Drive improvements in product yield, reliability, performance, and market competitiveness.
  • Transfer advanced technology nodes from headquarters to local manufacturing.
  • Coordinate with cross-functional teams to resolve technical issues within the NSPC module.

What we're looking for

  • Bachelor’s Degree or higher in Electrical Engineering, Chemical Engineering, Materials Science, Physics, Chemistry, or a related field.
  • Advanced degrees in a related subject may substitute for fab experience.
  • 3+ years of experience in a FEOL related integration or unit process group.
  • Experience in GAA integration or related fab processes (preferred).
  • Authorization to access information subject to U.S. export control laws or eligibility for government authorization.

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