Data Collection & Exploratory Hardware Platforms EPM

Apple Inc

Confirmed live yesterday High trust

Quick summary

Work type: On-site
Location: San Diego, CA
Salary: $137,500–$250,700 / yr
Posted: 35 days ago
Freshness: Confirmed live yesterday
Nearby: 99+ roles within 25 mi

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Salary context

Competitive pay

How this pay compares to similar roles

Similar $204k

This role $194k

$124k most similar roles pay here $265k

This role pays less than 55% of similar roles. Most pay $171,162–$235,912 — the shaded band above. At the midpoint, this role pays about $194k versus about $204k for comparable roles.

Based on 240 similar postings.

Employer

About Apple Inc

Apple Inc. is a multinational technology company known for designing and manufacturing consumer electronics, software, and online services, including the iPhone, Mac, iPad, and App Store. Industry: Consumer Electronics & Software

Apple Inc currently has 1984 open roles on FindRole.

Listed pay typically runs $175,000–$277,600 across 1590 roles with salary data.

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At a glance

TL;DR · Data Collection & Exploratory Hardware Platforms EPM

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The Data Collection & Exploratory Hardware Platforms EPM joins the Imaging and Sensing technology team to drive the development of early technology platforms, prototypes, and complex data collection systems. This role is critical for enabling machine learning algorithm development and user experience exploration while influencing product architecture decisions. The EPM manages hardware system development from concept through delivery, leading cross-functional teams across PD, EE, Optics, FW, and Test/Cal. Key responsibilities include driving system definition, managing project milestones, coordinating design reviews, and overseeing contract manufacturer operations including test line readiness and assembly SOPs. Candidates must possess technical literacy in hardware engineering fields like ME or photonics to navigate complex topics. The role requires expertise in managing programs involving PCBA, mechanical housings, and high-level assemblies to solve challenges in the imaging and sensing product space.

Skills

Hardware Engineering Systems Engineering Machine Learning Optics Photonics PCBA FPGA NPI SOP Assembly

What you'll do

Manage the development of data collection platforms and prototypes from concept through delivery.
Lead cross-functional engineering teams across PD, EE, Optics, Firmware, and Test/Calibration disciplines.
Drive system definition, technical closure, and resource management for early-stage hardware projects.
Develop and manage project milestones, timelines, and cost estimates while mitigating non-technical risks.
Coordinate with Contract Manufacturers to ensure assembly readiness, material flow, and test station qualification.
Translate complex technical issues into actionable status reports for executive management.
Oversee vendor operations and manufacturing processes for PCBA, mechanical housings, and complex components.

What we're looking for

Bachelor's degree or higher in a hardware engineering field such as ME, EE, Optics/Photonics, or Systems Engineering.
Minimum 4+ years of combined engineering and program management experience.
Experience with AR/VR, Cameras/Sensors, or Machine Learning (preferred).
Exceptional program management skills including proactive timeline estimation, goal definition, and inter-team coordination.
Technical literacy to engage in technical conversations across ME, EE, FW, optics, cameras, sensors, and systems engineering.
Outstanding communication, information synthesis, organizational, and leadership skills for executive and cross-functional audiences.
Experience working with vendors to develop and build PCBA, mechanical housings, high-level assemblies, and complex components.
Familiarity with fabrication techniques (preferred).